Apple 4-Core A16 vs Imagination PowerVR GE8300 800MHz Full Specs
512 Shaders 1.34GHz | 16 Shaders 800MHz |
Shared Memory51.2GB/sLPDDR5 | Shared Memory10.7GB/s ·· |
·· 1.37 TFLOPS | ·· 25.6 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
4-Core A161.37 TFLOPSFP16
PowerVR GE8300 800MHz51.2 GFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 1.37 TFLOPSFP16 | Peak OPS 51.2 GFLOPSFP16 |
FP32 1.37 TFLOPS | FP32 25.6 GFLOPS |
Pixel Rate 21.4 GPixel/s | Pixel Rate 0.8 GPixel/s |
Texture Rate 42.8 GTexel/s | Texture Rate 0.8 GTexel/s |
Shaders 512 Shaders | Shaders 16 Shaders |
TMUs 32 TMUs | TMUs 1 TMU |
ROPs 16 ROPs | ROPs 1 ROP |
EUs 64 EUs | EU 1 EU |
Boost Clock 1.34GHz | Boost Clock 800MHz |
L2 Cache 512KB shared | L2 Cache - |
Shared MemoryLPDDR5 | Shared Memory ·· |
Memory Bus 64-bit | Memory Bus 32-bit |
Memory Speed 6.4GT/s | Memory Speed 2.7GT/s |
Memory Bandwidth 51.2GB/s | Memory Bandwidth 10.7GB/s |
ECC No | ECC No |
Multi-Monitor 1 | Multi-Monitor - |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename G15P | Codename Series8XE |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Mar 4, 2025 | Release Date May 1, 2019 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4P | Fabrication Node N7 |
Die Size 115mm² | Die Size - |
Transistor Count 16 Billion | Transistor Count - |
Transistor Density 139 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs | CPUs |
Tablets | Tablets - |