Apple 4-Core A18 vs Imagination PowerVR GX6450 A8 Full Specs

Summary

512 Shaders 1.34GHz	128 Shaders 475MHz
Shared Memory60GB/sLPDDR5X	Shared Memory12.8GB/sLPDDR3
Peak·FP32·FP16 1.37 TFLOPS	Peak·FP32·FP16 121.6 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed1338MHz UC·Boost·OC	Clock Speed475MHz UC·Boost·OC
Peak OPS 1.37 TFLOPSFP16	Peak OPS 243.2 GFLOPSFP16
FP32 1.37 TFLOPS	FP32 121.6 GFLOPS
-	FP64 7.6 GFLOPS
Pixel Rate 21.4 GPixel/s	Pixel Rate 3.8 GPixel/s
Texture Rate 42.8 GTexel/s	Texture Rate 3.8 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 128 Shaders
TMUs 32 TMUs	TMUs 8 TMUs
ROPs 16 ROPs	ROPs 8 ROPs
RT Cores 4 RT-Cores	RT Cores -
EUs 64 EUs	EUs 8 EUs

Clocks

Boost Clock 1.34GHz

Boost Clock 475MHz

Cache

L2 Cache 768KB shared

L2 Cache -

Memory

Shared MemoryLPDDR5X	Shared MemoryLPDDR3
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 7.5GT/s	Memory Speed 1.6GT/s
Memory Bandwidth 60GB/s	Memory Bandwidth 12.8GB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor 1

Encoder

Encoder Model Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) ProRes	Codec -

Decoder

Decoder Model Apple Media Engine 3	-
Codec AVC (H.264) HEVC (H.265) AV1 ProRes	Codec -

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Apple	Manufacturer Imagination
Chip Designer Apple	Chip Designer Imagination
Architecture Apple Gen 7	Architecture Rogue
Family A Series	Family A Series
Branding	Branding
Codename G17A	Codename Series6XT
Chip Variant -	Chip Variant GXA6450
Market Segment Smartphone	Market Segment Smartphone
Release Date Feb 19, 2025	Release Date Sep 19, 2014

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3E	Fabrication Node 20nm
Die Size 90mm²	Die Size 89mm²
Transistor Count 15.5 Billion	Transistor Count 2 Billion
Transistor Density 172 MTr/mm²	Transistor Density 22 MTr/mm²

Images