GPUs

Apple 4-Core A19 vs Imagination IMG BXT-32-1024 MC1 Full Specs

512 Shaders
1.47GHz
512 Shaders
1GHz
Shared Memory68.3GB/sLPDDR5X
Shared Memory
··
1.5 TFLOPS
··
1.02 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

4-Core A194-Core A193.01 TFLOPSFP8-16 Tensor
x1.47
IMG BXT-32-1024 MC1IMG BXT-32-1024 MC12.05 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
3.01 TFLOPSFP8-16 Tensor
Peak OPS
2.05 TFLOPSFP16
Tensor FP8-16
3.01 TFLOPS
Tensor FP8-32
3.01 TFLOPS
-
Tensor FP16-16
1.5 TFLOPS
Tensor FP16-32
1.5 TFLOPS
-
FP32
1.5 TFLOPS
FP32
1.02 TFLOPS
-
FP64
64 GFLOPS
Pixel Rate
23.5 GPixel/s
Pixel Rate
32 GPixel/s
Texture Rate
47 GTexel/s
Texture Rate
64 GTexel/s

Shaders
512 Shaders
Shaders
512 Shaders
TMUs
32 TMUs
TMUs
64 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
Tensor Cores
4 T-Cores
Tensor Cores
-
RT Cores
4 RT-Cores
RT Cores
-
EUs
64 EUs
EUs
32 EUs

Boost Clock
1.47GHz
Boost Clock
1GHz

L2 Cache
1MB shared
L2 Cache
-

Shared MemoryLPDDR5X
Shared Memory
Memory Bus
64-bit
Memory Bus
-
Memory Speed
8.5GT/s
Memory Speed
-
Memory Bandwidth
68.3GB/s
Memory Bandwidth
-
ECC
No
ECC
No

Multi-Monitor
1
Multi-Monitor
-

Encoder Model
Apple Media Engine 3
-

Decoder Model
Apple Media Engine 3
-

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
A19 branding
Branding
IMG BXT branding
Codename
G18A
Codename
IMG B-Series
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Mar 2, 2026
Release Date
Oct 13, 2020

Foundry
TSMC
Foundry
-
Fabrication Node
N3P
Fabrication Node
-
Die Size
83mm²
Die Size
-
Transistor Count
14.3 Billion
Transistor Count
-
Transistor Density
172 MTr/mm²
Transistor Density
-

No images available
No images available

CPUs
CPUs
-
Smartphones
Smartphones
-