GPUs

Apple 6-Core A17 Pro vs Imagination PowerVR GT7850 Plus A10X Full Specs

768 Shaders
1.34GHz
384 Shaders
1.09GHz
Shared Memory51.2GB/sLPDDR5
Shared Memory51.2GB/sLPDDR4
··
2.06 TFLOPS
··
834.1 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

6-Core A17 Pro6-Core A17 Pro2.06 TFLOPSFP16
x1.23
PowerVR GT7850 Plus A10XPowerVR GT7850 Plus A10X1.67 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
2.06 TFLOPSFP16
Peak OPS
1.67 TFLOPSFP16
FP32
2.06 TFLOPS
FP32
834.1 GFLOPS
-
FP64
52.13 GFLOPS
Pixel Rate
32.1 GPixel/s
Pixel Rate
26.1 GPixel/s
Texture Rate
64.2 GTexel/s
Texture Rate
26.1 GTexel/s

Shaders
768 Shaders
Shaders
384 Shaders
TMUs
48 TMUs
TMUs
24 TMUs
ROPs
24 ROPs
ROPs
24 ROPs
RT Cores
6 RT-Cores
RT Cores
-
EUs
96 EUs
EUs
24 EUs

Boost Clock
1.34GHz
Boost Clock
1.09GHz

L2 Cache
768KB shared
L2 Cache
-

Shared MemoryLPDDR5
Shared MemoryLPDDR4
Memory Bus
64-bit
Memory Bus
128-bit
Memory Speed
6.4GT/s
Memory Speed
3.2GT/s
Memory Bandwidth
51.2GB/s
Memory Bandwidth
51.2GB/s

Multi-Monitor
1
Multi-Monitor
1

Encoder Model
Apple Media Engine 3
-

Decoder Model
Apple Media Engine 3
-

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Apple
Manufacturer
Imagination
Chip Designer
Apple
Chip Designer
Imagination
Architecture
Apple Gen 6
Architecture
Rogue
Family
A Series
Family
A Series
Branding
A17 Pro branding
Branding
PowerVR 2013 branding
Codename
G16P
Codename
Series7XTP
Chip Variant
-
Chip Variant
GT7850 Plus
Market Segment
Smartphone
Market Segment
Tablet
Release Date
Sep 12, 2023
Release Date
Jun 13, 2017

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3B
Fabrication Node
10FF
Die Size
104mm²
Die Size
96mm²
Transistor Count
19 Billion
Transistor Count
4 Billion
Transistor Density
183 MTr/mm²
Transistor Density
41 MTr/mm²

No images available
No images available