GPUs

Apple 6-Core A18 Pro vs Imagination PowerVR GX6450 A8 Full Specs

768 Shaders
1.47GHz
128 Shaders
475MHz
Shared Memory60GB/sLPDDR5X
Shared Memory12.8GB/sLPDDR3
··
2.26 TFLOPS
··
121.6 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

6-Core A18 Pro6-Core A18 Pro2.26 TFLOPSFP16
x9.28
PowerVR GX6450 A8PowerVR GX6450 A8243.2 GFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
2.26 TFLOPSFP16
Peak OPS
243.2 GFLOPSFP16
FP32
2.26 TFLOPS
FP32
121.6 GFLOPS
-
FP64
7.6 GFLOPS
Pixel Rate
35.3 GPixel/s
Pixel Rate
3.8 GPixel/s
Texture Rate
70.6 GTexel/s
Texture Rate
3.8 GTexel/s

Shaders
768 Shaders
Shaders
128 Shaders
TMUs
48 TMUs
TMUs
8 TMUs
ROPs
24 ROPs
ROPs
8 ROPs
RT Cores
6 RT-Cores
RT Cores
-
EUs
96 EUs
EUs
8 EUs

Boost Clock
1.47GHz
Boost Clock
475MHz

L2 Cache
768KB shared
L2 Cache
-

Shared MemoryLPDDR5X
Shared MemoryLPDDR3
Memory Bus
64-bit
Memory Bus
64-bit
Memory Speed
7.5GT/s
Memory Speed
1.6GT/s
Memory Bandwidth
60GB/s
Memory Bandwidth
12.8GB/s
ECC
No
ECC
No

Multi-Monitor
1
Multi-Monitor
1

Encoder Model
Apple Media Engine 3
-

Decoder Model
Apple Media Engine 3
-

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Apple
Manufacturer
Imagination
Chip Designer
Apple
Chip Designer
Imagination
Architecture
Apple Gen 7
Architecture
Rogue
Family
A Series
Family
A Series
Branding
A18 Pro branding
Branding
PowerVR 2013 branding
Codename
G17P
Codename
Series6XT
Chip Variant
-
Chip Variant
GXA6450
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 9, 2024
Release Date
Sep 19, 2014

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N3E
Fabrication Node
20nm
Die Size
110mm²
Die Size
89mm²
Transistor Count
18.4 Billion
Transistor Count
2 Billion
Transistor Density
168 MTr/mm²
Transistor Density
22 MTr/mm²

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