Apple 60-Core M2 Ultra vs Apple 40-Core M4 Max Full Specs
7,680 Shaders 1.4GHz | 5,120 Shaders 1.58GHz |
Shared Memory819.2GB/sLPDDR5 | Shared Memory546.1GB/sLPDDR5X |
·· 21.47 TFLOPS | ·· 16.16 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
60-Core M2 Ultra21.47 TFLOPSFP16
40-Core M4 Max16.16 TFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 21.47 TFLOPSFP16 | Peak OPS 16.16 TFLOPSFP16 |
FP32 21.47 TFLOPS | FP32 16.16 TFLOPS |
Pixel Rate 335.5 GPixel/s | Pixel Rate 252.5 GPixel/s |
Texture Rate 671 GTexel/s | Texture Rate 505 GTexel/s |
Shaders 7,680 Shaders | Shaders 5,120 Shaders |
TMUs 480 TMUs | TMUs 320 TMUs |
ROPs 240 ROPs | ROPs 160 ROPs |
RT Cores - | RT Cores 40 RT-Cores |
EUs 960 EUs | EUs 640 EUs |
Boost Clock 1.4GHz | Boost Clock 1.58GHz |
L2 Cache 16.4MB shared | L2 Cache 8.2MB shared |
Shared MemoryLPDDR5 | Shared MemoryLPDDR5X |
Memory Bus 1024-bit | Memory Bus 512-bit |
Memory Speed 6.4GT/s | Memory Speed 8.5GT/s |
Memory Bandwidth 819.2GB/s | Memory Bandwidth 546.1GB/s |
Multi-Monitor 8 | Multi-Monitor 4 |
Encoder Model 4x Apple Media Engine 2 | Encoder Model 2x Apple Media Engine 3 |
Decoder Model 2x Apple Media Engine 2 | Decoder Model 2x Apple Media Engine 3 |
Form Factor iGPU | Form Factor iGPU |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename G14D | Codename G16M |
Market Segment Workstation | Market Segment Laptop |
Release Date Jun 5, 2023 | Release Date Oct 30, 2024 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N5P | Fabrication Node N3E |
Die Size 971mm² | Die Size 454mm² |
Transistor Count 134 Billion | Transistor Count 76 Billion |
Transistor Density 138 MTr/mm² | Transistor Density 167 MTr/mm² |
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