GPUs

Apple Radeon Pro Vega II Duo vs NVIDIA GeForce RTX 3070 Ti Laptop 115W Full Specs

8,192 Shaders
1.72GHz
5,888 Shaders
1.41GHz
64GB HBM22.05TB/s
8GB GDDR6448GB/s
··
28.18 TFLOPS
··
16.6 TFLOPS
Form Factor
MPX
Form Factor
Soldered
TDP
475W
TDP
115W

Clock Speed
··
Clock Speed
···
Peak OPS
56.36 TFLOPSFP16
Peak OPS
531.3 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
66.42 TFLOPS
FP16-16 Tensor Sparse
132.8 TFLOPS
Tensor FP16-32
33.21 TFLOPS
FP16-32 Tensor Sparse
66.42 TFLOPS
-
BF16
16.6 TFLOPS
Tensor BF16
33.21 TFLOPS
BF16 Tensor Sparse
66.42 TFLOPS
Tensor TF32
-
Tensor TF32
16.6 TFLOPS
FP32
28.18 TFLOPS
FP32
16.6 TFLOPS
FP64
7.04 TFLOPS
FP64
259.4 GFLOPS
Tensor INT4
-
Tensor INT4
265.7 TOPS
-
Tensor INT8
132.8 TOPS
Ray
-
Ray
25.04 TOPS
Pixel Rate
110.1 GPixel/s
Pixel Rate
135.4 GPixel/s
Texture Rate
440.3 GTexel/s
Texture Rate
259.4 GTexel/s

Shaders
8,192 Shaders
Shaders
5,888 Shaders
TMUs
512 TMUs
TMUs
184 TMUs
ROPs
128 ROPs
ROPs
96 ROPs
Tensor Cores
-
Tensor Cores
184 T-Cores
RT Cores
-
RT Cores
46 RT-Cores
CUs
128 CUs
SMs
46 SMs

Base Clock
-
Base Clock
915MHz
Boost Clock
1.72GHz
Boost Clock
1.41GHz

L2 Cache
4MB shared
L2 Cache
4MB shared

64GB HBM2
8GB GDDR6
Memory Bus
4096-bit
Memory Bus
256-bit
Memory Speed
2GT/s
Memory Speed
14GT/s
Memory Bandwidth
2.05TB/s
Memory Bandwidth
448GB/s
ECC
No
ECC
No

TDP
475W
TDP
115W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
HDCP 2.3

1x HDMI 2.0
4x Thunderbolt 3
-

Encoder Model
VCE 4.1
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
UVD 7.2
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
-
AVC (H.264)
HEVC (H.265)
-
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
MPX
Form Factor
Soldered
PCIe
4-Slots
PCIe
-
Cooling
Passive
Cooling
Open-Air

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Vega Pro branding
Branding
GeForce RTX 2018 branding
Codename
Moonshot
Codename
NV174
Chip Variant
Vega 20 XT
Chip Variant
GA104-150-A1
Market Segment
Workstation
Market Segment
Laptop
Release Date
Dec 1, 2019
Release Date
Jan 12, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7
Fabrication Node
8N
Die Size
331mm²
Die Size
393mm²
Transistor Count
13.2 Billion
Transistor Count
17.4 Billion
Transistor Density
39.97 MTr/mm²
Transistor Density
44.33 MTr/mm²