GPUs

Apple Radeon Pro Vega II vs NVIDIA GeForce RTX 3070 Ti Laptop 100W Full Specs

4,096 Shaders
1.72GHz
5,888 Shaders
1.2GHz
32GB HBM21.02TB/s
8GB GDDR6448GB/s
··
14.09 TFLOPS
··
14.13 TFLOPS
Form Factor
MPX
Form Factor
Soldered
TDP
300W
TDP
100W

Clock Speed
··
Clock Speed
···
Peak OPS
28.18 TFLOPSFP16
Peak OPS
452.2 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
56.52 TFLOPS
FP16-16 Tensor Sparse
113 TFLOPS
Tensor FP16-32
28.26 TFLOPS
FP16-32 Tensor Sparse
56.52 TFLOPS
-
BF16
14.13 TFLOPS
Tensor BF16
28.26 TFLOPS
BF16 Tensor Sparse
56.52 TFLOPS
Tensor TF32
-
Tensor TF32
14.13 TFLOPS
FP32
14.09 TFLOPS
FP32
14.13 TFLOPS
FP64
3.52 TFLOPS
FP64
220.8 GFLOPS
Tensor INT4
-
Tensor INT4
226.1 TOPS
-
Tensor INT8
113 TOPS
Ray
-
Ray
21.31 TOPS
Pixel Rate
110.1 GPixel/s
Pixel Rate
115.2 GPixel/s
Texture Rate
440.3 GTexel/s
Texture Rate
220.8 GTexel/s

Shaders
4,096 Shaders
Shaders
5,888 Shaders
TMUs
256 TMUs
TMUs
184 TMUs
ROPs
64 ROPs
ROPs
96 ROPs
Tensor Cores
-
Tensor Cores
184 T-Cores
RT Cores
-
RT Cores
46 RT-Cores
CUs
64 CUs
SMs
46 SMs

Base Clock
-
Base Clock
900MHz
Boost Clock
1.72GHz
Boost Clock
1.2GHz

L2 Cache
4MB shared
L2 Cache
4MB shared

32GB HBM2
8GB GDDR6
Memory Bus
4096-bit
Memory Bus
256-bit
Memory Speed
2GT/s
Memory Speed
14GT/s
Memory Bandwidth
1.02TB/s
Memory Bandwidth
448GB/s
ECC
No
ECC
No

TDP
300W
TDP
100W

Multi-Monitor
3
Multi-Monitor
3
HDCP
HDCP 2.2
HDCP
HDCP 2.3

1x HDMI 2.0
4x Thunderbolt 3
-

Encoder Model
VCE 4.1
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
Codec
AVC (H.264)
HEVC (H.265)

Decoder Model
UVD 7.2
Decoder Model
NVDEC 5
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
-
AVC (H.264)
HEVC (H.265)
-
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
MPX
Form Factor
Soldered
PCIe
4-Slots
PCIe
-
Cooling
Passive
Cooling
Open-Air

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Vega Pro branding
Branding
GeForce RTX 2018 branding
Codename
Moonshot
Codename
NV174
Chip Variant
Vega 20 XT
Chip Variant
GA104-150-A1
Market Segment
Workstation
Market Segment
Laptop
Release Date
Dec 1, 2019
Release Date
Jan 12, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7
Fabrication Node
8N
Die Size
331mm²
Die Size
393mm²
Transistor Count
13.2 Billion
Transistor Count
17.4 Billion
Transistor Density
39.97 MTr/mm²
Transistor Density
44.33 MTr/mm²