ASUS GeForce RTX 3070 Ti TUF OC vs Intel Arc A770M Full Specs
6,144 Shaders 1.81GHz | 4,096 Shaders 1.65GHz |
8GB GDDR6X608.3GB/s | 16GB GDDR6512GB/s |
·· 22.3 TFLOPS | ·· 13.52 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 290W | TDP 120W |
Power Connectors 2x 8-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 713.7 TOPSINT4 Tensor Sparse | Peak OPS 432.5 TOPSINT4 Tensor |
Tensor FP16-16 89.21 TFLOPSFP16-16 Tensor Sparse 178.4 TFLOPSTensor FP16-32 44.61 TFLOPSFP16-32 Tensor Sparse 89.21 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 108.1 TFLOPSFP16-32 Tensor Sparse - |
BF16 22.3 TFLOPSTensor BF16 44.61 TFLOPSBF16 Tensor Sparse 89.21 TFLOPS | BF16 -Tensor BF16 108.1 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 22.3 TFLOPS | Tensor TF32 - |
FP32 22.3 TFLOPS | FP32 13.52 TFLOPS |
FP64 348.5 GFLOPS | FP64 3.38 TFLOPS |
Tensor INT4 356.8 TOPS | Tensor INT4 432.5 TOPS |
Tensor INT8 178.4 TOPS | Tensor INT8 216.3 TOPS |
Ray 33.64 TOPS | Ray - |
Pixel Rate 174.2 GPixel/s | Pixel Rate 211.2 GPixel/s |
Texture Rate 348.5 GTexel/s | Texture Rate 422.4 GTexel/s |
Shaders 6,144 Shaders | Shaders 4,096 Shaders |
TMUs 192 TMUs | TMUs 256 TMUs |
ROPs 96 ROPs | ROPs 128 ROPs |
Tensor Cores 192 T-Cores | Tensor Cores 512 T-Cores |
RT Cores 48 RT-Cores | RT Cores 32 RT-Cores |
SMs 48 SMs | EUs 512 EUs |
Base Clock 1.57GHz | Base Clock 300MHz |
Boost Clock 1.81GHz | Boost Clock 1.65GHz |
L2 Cache 4.1MB shared | L2 Cache 8.2MB shared |
8GB GDDR6X | 16GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 19GT/s | Memory Speed 16GT/s |
Memory Bandwidth 608.3GB/s | Memory Bandwidth 512GB/s |
TDP 290W | TDP 120W |
Max Temp 93°C Max | Max Temp - |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
3x DisplayPort 1.4 | - |
2x HDMI 2.1 | - |
Encoder Model NVENC 7 | Encoder Model Arc |
Decoder Model NVDEC 5 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2.5-Slots | PCIe - |
Height 126.9 mm (5")Width 299.9 mm (11.81")Depth 51.7 mm (2.04") | - |
Cooling Open-Air 3x Fans | Cooling Open-Air - |
Power Connectors 2x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV174 | Codename Xe HPG |
Chip Variant GA104-150-A1 | Chip Variant DG2-512 |
Market Segment Desktop | Market Segment Laptop |
Release Date Jun 10, 2021 | Release Date Jun 28, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 393mm² | Die Size 406mm² |
Transistor Count 17.4 Billion | Transistor Count 21.7 Billion |
Transistor Density 44.33 MTr/mm² | Transistor Density 53.45 MTr/mm² |
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