ATI FirePro 3D V3750 Full Specs

Summary

320 Shaders 550MHz

256MB GDDR324GB/s

Peak·FP32·FP16 352 GFLOPS

Form Factor PCIe Card

TDP 48W

Theoretical Performance

Clock Speed550MHz UC·Boost·OC

Peak OPS 352 GFLOPSFP32

FP32 352 GFLOPS

Pixel Rate 4.4 GPixel/s

Texture Rate 17.6 GTexel/s

Core Config

Shaders 320 Shaders

TMUs 32 TMUs

ROPs 8 ROPs

CUs 4 CUs

Clocks

Boost Clock 550MHz

Cache

L2 Cache 256KB shared

Memory

256MB GDDR3

Memory Bus 128-bit

Memory Speed 1.5GT/s

Memory Bandwidth 24GB/s

ECC No

Power & Thermals

TDP 48W

Video Output

Multi-Monitor 2

Ports

2x DisplayPort 1.0 1x DVI-I Dual-Link

Decoder

Decoder Model UVD 2.0

Codec VC-1 AVC (H.264)

Card

Form Factor PCIe Card

PCIe 1-Slots

Height 111 mm (4.37") Width 168 mm (6.61") Depth 20 mm (0.79")

Cooling Blower 1x Fan

Chip

Manufacturer ATI

Chip Designer ATI

Architecture TeraScale 1

Family FirePro V

Branding

Codename Mario

Chip Variant RV730 Pro

Market Segment Workstation

Release Date Sep 11, 2008

Fabrication

Foundry TSMC

Fabrication Node 55nm

Die Size 146mm²

Transistor Count 514 Million

Transistor Density 3.52 MTr/mm²

Images