ATI Mobility Radeon HD 560v vs NVIDIA GeForce RTX 5060 Laptop 50W Full Specs
320 Shaders 550MHz | 3,328 Shaders 1.89GHz |
1GB GDDR325.6GB/s | 8GB GDDR7354.8GB/s |
·· 352 GFLOPS | ·· 12.58 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 15W | TDP 45W |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 352 GFLOPSFP32 | Peak OPS 402.6 TFLOPSFP4 Tensor Sparse |
- | Tensor FP4 201.3 TFLOPSFP4 Tensor Sparse 402.6 TFLOPS |
- | Tensor FP8-16 100.6 TFLOPSFP8-16 Tensor Sparse 201.3 TFLOPSTensor FP8-32 50.32 TFLOPSFP8-32 Tensor Sparse 100.6 TFLOPS |
- | Tensor FP16-16 50.32 TFLOPSFP16-16 Tensor Sparse 100.6 TFLOPSTensor FP16-32 25.16 TFLOPSFP16-32 Tensor Sparse 50.32 TFLOPS |
- | BF16 12.58 TFLOPSTensor BF16 25.16 TFLOPSBF16 Tensor Sparse 50.32 TFLOPS |
Tensor TF32 - | Tensor TF32 12.58 TFLOPS |
FP32 352 GFLOPS | FP32 12.58 TFLOPS |
- | FP64 196.6 GFLOPS |
- | Tensor INT8 100.6 TOPS |
Ray - | Ray 38.15 TOPS |
Pixel Rate 4.4 GPixel/s | Pixel Rate 60.5 GPixel/s |
Texture Rate 17.6 GTexel/s | Texture Rate 196.6 GTexel/s |
Shaders 320 Shaders | Shaders 3,328 Shaders |
TMUs 32 TMUs | TMUs 104 TMUs |
ROPs 8 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 104 T-Cores |
RT Cores - | RT Cores 26 RT-Cores |
CUs 4 CUs | SMs 26 SMs |
Base Clock - | Base Clock 1.54GHz |
Boost Clock 550MHz | Boost Clock 1.89GHz |
Tensor Clock - | Tensor Clock 1.89GHz |
L2 Cache 256KB shared | L2 Cache 32.8MB shared |
1GB GDDR3 | 8GB GDDR7 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.6GT/s | Memory Speed 22.2GT/s |
Memory Bandwidth 25.6GB/s | Memory Bandwidth 354.8GB/s |
TDP 15W | TDP 45W |
Multi-Monitor 2 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
- | Encoder Model NVENC 9 |
Decoder Model UVD 2.0 | Decoder Model NVDEC 6 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Mario | Codename NV196 |
Chip Variant RV730 Pro | Chip Variant - |
Market Segment Laptop | Market Segment Laptop |
Release Date May 5, 2010 | Release Date May 5, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node 4NP |
Die Size 146mm² | Die Size 183mm² |
Transistor Count 514 Million | Transistor Count 23 Billion |
Transistor Density 3.52 MTr/mm² | Transistor Density 125.7 MTr/mm² |
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