GPUs

ATI Radeon HD 4710 vs MSI GeForce RTX 3050 LP 6G OC Full Specs

320 Shaders
750MHz
2,304 Shaders
1.49GHz
1GB GDDR325.6GB/s
6GB GDDR6168GB/s
··
480 GFLOPS
··
6.88 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
59W
TDP
70W
Power Connectors
1x 6-Pin
Power Connectors
-

Radeon HD 4710Radeon HD 4710480 GFLOPSFP32
x1
GeForce RTX 3050 LP 6G OCGeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
x458.34

Clock Speed
··
Clock Speed
···
Peak OPS
480 GFLOPSFP32
Peak OPS
220 TOPSINT4 Tensor Sparse
-
Tensor FP16-16
27.5 TFLOPS
FP16-16 Tensor Sparse
55 TFLOPS
Tensor FP16-32
13.75 TFLOPS
FP16-32 Tensor Sparse
27.5 TFLOPS
-
BF16
6.88 TFLOPS
Tensor BF16
13.75 TFLOPS
BF16 Tensor Sparse
27.5 TFLOPS
Tensor TF32
-
Tensor TF32
6.88 TFLOPS
FP32
480 GFLOPS
FP32
6.88 TFLOPS
FP64
96 GFLOPS
FP64
107.4 GFLOPS
Tensor INT4
-
Tensor INT4
110 TOPS
-
Tensor INT8
55 TOPS
Ray
-
Ray
10.37 TOPS
Pixel Rate
6 GPixel/s
Pixel Rate
47.7 GPixel/s
Texture Rate
24 GTexel/s
Texture Rate
107.4 GTexel/s

Shaders
320 Shaders
Shaders
2,304 Shaders
TMUs
32 TMUs
TMUs
72 TMUs
ROPs
8 ROPs
ROPs
32 ROPs
Tensor Cores
-
Tensor Cores
72 T-Cores
RT Cores
-
RT Cores
18 RT-Cores
CUs
8 CUs
SMs
18 SMs

Base Clock
-
Base Clock
1.04GHz
Boost Clock
750MHz
Boost Clock
1.49GHz

L2 Cache
256KB shared
L2 Cache
2MB shared

1GB GDDR3
6GB GDDR6
Memory Bus
128-bit
Memory Bus
96-bit
Memory Speed
1.6GT/s
Memory Speed
14GT/s
Memory Bandwidth
25.6GB/s
Memory Bandwidth
168GB/s

TDP
59W
TDP
70W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
1x DisplayPort 1.4
-
2x HDMI 2.1
2x DVI-I Dual-Link
-
1x S-Video
-

-
Encoder Model
NVENC 7

Decoder Model
UVD 2.0
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
1-Slots
PCIe
2-Slots
-
Height
69 mm (2.72")
Width
174 mm (6.85")
Depth
40 mm (1.57")
Cooling
Open-Air
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
1x 6-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2008 branding
Branding
GeForce RTX 2018 branding
Codename
Wekiva
Codename
NV177
Chip Variant
RV770 CE
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Sep 10, 2008
Release Date
Feb 2, 2024

Foundry
TSMC
Foundry
Samsung
Fabrication Node
55nm
Fabrication Node
8N
Die Size
256mm²
Die Size
200mm²
Transistor Count
956 Million
Transistor Count
8.7 Billion
Transistor Density
3.73 MTr/mm²
Transistor Density
43.5 MTr/mm²

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