GIGABYTE GeForce RTX 3050 OC Low Profile 6G vs Intel Arc Pro A50 Full Specs
2,304 Shaders 1.48GHz | 1,024 Shaders 2.35GHz |
6GB GDDR6168GB/s | 6GB GDDR6192GB/s |
·· 6.81 TFLOPS | ·· 4.81 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 75W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 217.8 TOPSINT4 Tensor Sparse | Peak OPS 154 TOPSINT4 Tensor |
Tensor FP16-16 27.22 TFLOPSFP16-16 Tensor Sparse 54.45 TFLOPSTensor FP16-32 13.61 TFLOPSFP16-32 Tensor Sparse 27.22 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 38.5 TFLOPSFP16-32 Tensor Sparse - |
BF16 6.81 TFLOPSTensor BF16 13.61 TFLOPSBF16 Tensor Sparse 27.22 TFLOPS | BF16 -Tensor BF16 38.5 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 6.81 TFLOPS | Tensor TF32 - |
FP32 6.81 TFLOPS | FP32 4.81 TFLOPS |
FP64 106.3 GFLOPS | FP64 1.2 TFLOPS |
Tensor INT4 108.9 TOPS | Tensor INT4 154 TOPS |
Tensor INT8 54.45 TOPS | Tensor INT8 77 TOPS |
Ray 10.26 TOPS | Ray - |
Pixel Rate 47.3 GPixel/s | Pixel Rate 75.2 GPixel/s |
Texture Rate 106.3 GTexel/s | Texture Rate 150.4 GTexel/s |
Shaders 2,304 Shaders | Shaders 1,024 Shaders |
TMUs 72 TMUs | TMUs 64 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores 72 T-Cores | Tensor Cores 128 T-Cores |
RT Cores 18 RT-Cores | RT Cores 8 RT-Cores |
SMs 18 SMs | EUs 128 EUs |
Base Clock 1.04GHz | Base Clock 2GHz |
Boost Clock 1.48GHz | Boost Clock 2.35GHz |
L2 Cache 2MB shared | L2 Cache 4.1MB shared |
6GB GDDR6 | 6GB GDDR6 |
Memory Bus 96-bit | Memory Bus 96-bit |
Memory Speed 14GT/s | Memory Speed 16GT/s |
Memory Bandwidth 168GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 70W | TDP 75W |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
2x DisplayPort 1.4 | - |
- | 4x Mini DisplayPort 2.0 |
2x HDMI 2.1 | - |
Encoder Model NVENC 7 | Encoder Model Arc |
Decoder Model NVDEC 5 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1.8-Slots | PCIe 2-Slots |
Height 69 mm (2.72")Width 181 mm (7.13")Depth 36 mm (1.42") | - |
Cooling Open-Air 2x Fans | Cooling Blower 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Xe HPG |
Chip Variant GA107-140-A1 | Chip Variant DG2-128 |
Market Segment Desktop | Market Segment Workstation |
Release Date Feb 2, 2024 | Release Date Aug 8, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 200mm² | Die Size 157mm² |
Transistor Count 8.7 Billion | Transistor Count 7.2 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 45.86 MTr/mm² |
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