GIGABYTE GeForce RTX 3060 Ti Gaming OC Pro vs Intel Arc A770M Full Specs
4,864 Shaders 1.77GHz | 4,096 Shaders 1.65GHz |
8GB GDDR6448GB/s | 16GB GDDR6512GB/s |
·· 17.22 TFLOPS | ·· 13.52 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 200W | TDP 120W |
Power Connectors 1x 8-Pin 1x 6-Pin | Power Connectors - |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 551 TOPSINT4 Tensor Sparse | Peak OPS 432.5 TOPSINT4 Tensor |
Tensor FP16-16 68.87 TFLOPSFP16-16 Tensor Sparse 137.7 TFLOPSTensor FP16-32 34.44 TFLOPSFP16-32 Tensor Sparse 68.87 TFLOPS | Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 108.1 TFLOPSFP16-32 Tensor Sparse - |
BF16 17.22 TFLOPSTensor BF16 34.44 TFLOPSBF16 Tensor Sparse 68.87 TFLOPS | BF16 -Tensor BF16 108.1 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 17.22 TFLOPS | Tensor TF32 - |
FP32 17.22 TFLOPS | FP32 13.52 TFLOPS |
FP64 269 GFLOPS | FP64 3.38 TFLOPS |
Tensor INT4 275.5 TOPS | Tensor INT4 432.5 TOPS |
Tensor INT8 137.7 TOPS | Tensor INT8 216.3 TOPS |
Ray 25.97 TOPS | Ray - |
Pixel Rate 141.6 GPixel/s | Pixel Rate 211.2 GPixel/s |
Texture Rate 269 GTexel/s | Texture Rate 422.4 GTexel/s |
Shaders 4,864 Shaders | Shaders 4,096 Shaders |
TMUs 152 TMUs | TMUs 256 TMUs |
ROPs 80 ROPs | ROPs 128 ROPs |
Tensor Cores 152 T-Cores | Tensor Cores 512 T-Cores |
RT Cores 38 RT-Cores | RT Cores 32 RT-Cores |
SMs 38 SMs | EUs 512 EUs |
Base Clock 1.41GHz | Base Clock 300MHz |
Boost Clock 1.77GHz | Boost Clock 1.65GHz |
L2 Cache 4.1MB shared | L2 Cache 8.2MB shared |
8GB GDDR6 | 16GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 14GT/s | Memory Speed 16GT/s |
Memory Bandwidth 448GB/s | Memory Bandwidth 512GB/s |
ECC No | ECC No |
TDP 200W | TDP 120W |
Max Temp 93°C Max | Max Temp - |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
2x DisplayPort 1.4 | - |
2x HDMI 2.1 | - |
Encoder Model NVENC 7 | Encoder Model Arc |
Decoder Model NVDEC 5 | Decoder Model Arc |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 117 mm (4.61")Width 281 mm (11.06")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Power Connectors 1x 8-Pin, 1x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV174 | Codename Xe HPG |
Chip Variant GA104-150-A1 | Chip Variant DG2-512 |
Market Segment Desktop | Market Segment Laptop |
Release Date Dec 2, 2020 | Release Date Jun 28, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 393mm² | Die Size 406mm² |
Transistor Count 17.4 Billion | Transistor Count 21.7 Billion |
Transistor Density 44.33 MTr/mm² | Transistor Density 53.45 MTr/mm² |
No images available
No images available



