GPUs

Imagination IMG BXT-32-1024 MC1 vs Apple 4-Core A19 Full Specs

512 Shaders
1GHz
512 Shaders
1.47GHz
Shared Memory
Shared Memory68.3GB/sLPDDR5X
··
1.02 TFLOPS
··
1.5 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

IMG BXT-32-1024 MC1IMG BXT-32-1024 MC12.05 TFLOPSFP16
x1
4-Core A194-Core A193.01 TFLOPSFP8-16 Tensor
x1.47

Clock Speed
··
Clock Speed
··
Peak OPS
2.05 TFLOPSFP16
Peak OPS
3.01 TFLOPSFP8-16 Tensor
-
Tensor FP8-16
3.01 TFLOPS
Tensor FP8-32
3.01 TFLOPS
-
Tensor FP16-16
1.5 TFLOPS
Tensor FP16-32
1.5 TFLOPS
FP32
1.02 TFLOPS
FP32
1.5 TFLOPS
FP64
64 GFLOPS
-
Pixel Rate
32 GPixel/s
Pixel Rate
23.5 GPixel/s
Texture Rate
64 GTexel/s
Texture Rate
47 GTexel/s

Shaders
512 Shaders
Shaders
512 Shaders
TMUs
64 TMUs
TMUs
32 TMUs
ROPs
32 ROPs
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
4 T-Cores
RT Cores
-
RT Cores
4 RT-Cores
EUs
32 EUs
EUs
64 EUs

Boost Clock
1GHz
Boost Clock
1.47GHz

L2 Cache
-
L2 Cache
1MB shared

Shared Memory
Shared MemoryLPDDR5X
Memory Bus
-
Memory Bus
64-bit
Memory Speed
-
Memory Speed
8.5GT/s
Memory Bandwidth
-
Memory Bandwidth
68.3GB/s

Multi-Monitor
-
Multi-Monitor
1

-
Encoder Model
Apple Media Engine 3

-
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
IMG BXT branding
Branding
A19 branding
Codename
IMG B-Series
Codename
G18A
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 13, 2020
Release Date
Mar 2, 2026

Foundry
-
Foundry
TSMC
Fabrication Node
-
Fabrication Node
N3P
Die Size
-
Die Size
83mm²
Transistor Count
-
Transistor Count
14.3 Billion
Transistor Density
-
Transistor Density
172 MTr/mm²

No images available
No images available

CPUs
-
CPUs
Smartphones
-
Smartphones