Imagination PowerVR G6050 vs Imagination PowerVR G6400 457MHz Full Specs
16 Shaders 600MHz | 128 Shaders 457MHz |
Shared Memory | Shared Memory8.5GB/sLPDDR3 |
·· 19.2 GFLOPS | ·· 117 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
PowerVR G605028.8 GFLOPSFP16PowerVR G6400 457MHz175.5 GFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 28.8 GFLOPSFP16 | Peak OPS 175.5 GFLOPSFP16 |
FP32 19.2 GFLOPS | FP32 117 GFLOPS |
FP64 1.2 GFLOPS | FP64 7.31 GFLOPS |
Pixel Rate 0.6 GPixel/s | Pixel Rate 3.7 GPixel/s |
Texture Rate 0.6 GTexel/s | Texture Rate 3.7 GTexel/s |
Shaders 16 Shaders | Shaders 128 Shaders |
TMUs 1 TMU | TMUs 8 TMUs |
ROPs 1 ROP | ROPs 8 ROPs |
EU 1 EU | EUs 8 EUs |
Boost Clock 600MHz | Boost Clock 457MHz |
Shared Memory | Shared MemoryLPDDR3 |
Memory Bus - | Memory Bus 64-bit |
Memory Speed - | Memory Speed 1.1GT/s |
Memory Bandwidth - | Memory Bandwidth 8.5GB/s |
ECC No | ECC No |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding |
Codename Series6XE | Codename Series6 |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Jan 1, 2014 | Release Date Mar 1, 2014 |
Foundry - | Foundry Intel |
Fabrication Node - | Fabrication Node 22nm |
Die Size - | Die Size 77mm² |
Transistor Count - | Transistor Count 600 Million |
Transistor Density - | Transistor Density 8 MTr/mm² |
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CPUs - | CPUs |