Imagination PowerVR G6200 450MHz vs Imagination PowerVR G6430 533MHz Full Specs
64 Shaders 450MHz | 128 Shaders 533MHz |
Shared Memory14.9GB/s · | Shared Memory12.8GB/sLPDDR3 |
·· 57.6 GFLOPS | ·· 136.5 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
PowerVR G6200 450MHz86.4 GFLOPSFP16PowerVR G6430 533MHz204.7 GFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 86.4 GFLOPSFP16 | Peak OPS 204.7 GFLOPSFP16 |
FP32 57.6 GFLOPS | FP32 136.5 GFLOPS |
FP64 3.6 GFLOPS | FP64 8.53 GFLOPS |
Pixel Rate 1.8 GPixel/s | Pixel Rate 4.3 GPixel/s |
Texture Rate 1.8 GTexel/s | Texture Rate 4.3 GTexel/s |
Shaders 64 Shaders | Shaders 128 Shaders |
TMUs 4 TMUs | TMUs 8 TMUs |
ROPs 4 ROPs | ROPs 8 ROPs |
EUs 4 EUs | EUs 8 EUs |
Boost Clock 450MHz | Boost Clock 533MHz |
Shared Memory · | Shared MemoryLPDDR3 |
Memory Bus 64-bit | Memory Bus 64-bit |
Memory Speed 1.9GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 14.9GB/s | Memory Bandwidth 12.8GB/s |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding |
Codename Series6 | Codename Series6 |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Feb 1, 2014 | Release Date Jul 1, 2014 |
Foundry TSMC | Foundry Intel |
Fabrication Node 28nm HPM | Fabrication Node 22nm |
Die Size - | Die Size 100mm² |
Transistor Count - | Transistor Count 800 Million |
Transistor Density - | Transistor Density 8 MTr/mm² |
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CPUs | CPUs |