Imagination PowerVR G6400 457MHz vs Imagination PowerVR G6430 457MHz Full Specs
128 Shaders 457MHz | 128 Shaders 457MHz |
Shared Memory8.5GB/sLPDDR3 | Shared Memory12.8GB/sLPDDR3 |
·· 117 GFLOPS | ·· 117 GFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 175.5 GFLOPSFP16 | Peak OPS 175.5 GFLOPSFP16 |
FP32 117 GFLOPS | FP32 117 GFLOPS |
FP64 7.31 GFLOPS | FP64 7.31 GFLOPS |
Pixel Rate 3.7 GPixel/s | Pixel Rate 3.7 GPixel/s |
Texture Rate 3.7 GTexel/s | Texture Rate 3.7 GTexel/s |
Shaders 128 Shaders | Shaders 128 Shaders |
TMUs 8 TMUs | TMUs 8 TMUs |
ROPs 8 ROPs | ROPs 8 ROPs |
EUs 8 EUs | EUs 8 EUs |
Boost Clock 457MHz | Boost Clock 457MHz |
Shared MemoryLPDDR3 | Shared MemoryLPDDR3 |
Memory Bus 64-bit | Memory Bus 64-bit |
Memory Speed 1.1GT/s | Memory Speed 1.6GT/s |
Memory Bandwidth 8.5GB/s | Memory Bandwidth 12.8GB/s |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Series6 | Codename Series6 |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Mar 1, 2014 | Release Date Jul 1, 2014 |
Foundry Intel | Foundry Intel |
Fabrication Node 22nm | Fabrication Node 22nm |
Die Size 77mm² | Die Size 100mm² |
Transistor Count 600 Million | Transistor Count 800 Million |
Transistor Density 8 MTr/mm² | Transistor Density 8 MTr/mm² |
No images available
No images available
CPUs | CPUs |

