GPUs

Imagination PowerVR GE8300 800MHz vs Apple 4-Core A19 Full Specs

16 Shaders
800MHz
512 Shaders
1.47GHz
Shared Memory10.7GB/s
··
Shared Memory68.3GB/sLPDDR5X
··
25.6 GFLOPS
··
1.5 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

PowerVR GE8300 800MHzPowerVR GE8300 800MHz51.2 GFLOPSFP16
x1
4-Core A194-Core A193.01 TFLOPSFP8-16 Tensor
x58.80

Clock Speed
··
Clock Speed
··
Peak OPS
51.2 GFLOPSFP16
Peak OPS
3.01 TFLOPSFP8-16 Tensor
-
Tensor FP8-16
3.01 TFLOPS
Tensor FP8-32
3.01 TFLOPS
-
Tensor FP16-16
1.5 TFLOPS
Tensor FP16-32
1.5 TFLOPS
FP32
25.6 GFLOPS
FP32
1.5 TFLOPS
Pixel Rate
0.8 GPixel/s
Pixel Rate
23.5 GPixel/s
Texture Rate
0.8 GTexel/s
Texture Rate
47 GTexel/s

Shaders
16 Shaders
Shaders
512 Shaders
TMUs
1 TMU
TMUs
32 TMUs
ROPs
1 ROP
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
4 T-Cores
RT Cores
-
RT Cores
4 RT-Cores
EU
1 EU
EUs
64 EUs

Boost Clock
800MHz
Boost Clock
1.47GHz

L2 Cache
-
L2 Cache
1MB shared

Shared Memory
··
Shared MemoryLPDDR5X
Memory Bus
32-bit
Memory Bus
64-bit
Memory Speed
2.7GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
10.7GB/s
Memory Bandwidth
68.3GB/s
ECC
No
ECC
No

Multi-Monitor
-
Multi-Monitor
1

-
Encoder Model
Apple Media Engine 3

-
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
PowerVR 2013 branding
Branding
A19 branding
Codename
Series8XE
Codename
G18A
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
May 1, 2019
Release Date
Mar 2, 2026

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N3P
Die Size
-
Die Size
83mm²
Transistor Count
-
Transistor Count
14.3 Billion
Transistor Density
-
Transistor Density
172 MTr/mm²

No images available
No images available

CPUs
CPUs
Smartphones
-
Smartphones