Imagination PowerVR GE8300 800MHz vs Apple 5-Core A16 Full Specs
16 Shaders 800MHz | 640 Shaders 1.34GHz |
Shared Memory10.7GB/s ·· | Shared Memory51.2GB/sLPDDR5 |
·· 25.6 GFLOPS | ·· 1.71 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP Shared |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 51.2 GFLOPSFP16 | Peak OPS 1.71 TFLOPSFP16 |
FP32 25.6 GFLOPS | FP32 1.71 TFLOPS |
Pixel Rate 0.8 GPixel/s | Pixel Rate 26.8 GPixel/s |
Texture Rate 0.8 GTexel/s | Texture Rate 53.5 GTexel/s |
Shaders 16 Shaders | Shaders 640 Shaders |
TMUs 1 TMU | TMUs 40 TMUs |
ROPs 1 ROP | ROPs 20 ROPs |
EU 1 EU | EUs 80 EUs |
Boost Clock 800MHz | Boost Clock 1.34GHz |
L2 Cache - | L2 Cache 512KB shared |
Shared Memory ·· | Shared MemoryLPDDR5 |
Memory Bus 32-bit | Memory Bus 64-bit |
Memory Speed 2.7GT/s | Memory Speed 6.4GT/s |
Memory Bandwidth 10.7GB/s | Memory Bandwidth 51.2GB/s |
ECC No | ECC No |
Multi-Monitor - | Multi-Monitor 1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Series8XE | Codename G15P |
Market Segment Smartphone | Market Segment Smartphone |
Release Date May 1, 2019 | Release Date Sep 16, 2022 |
Foundry - | Foundry TSMC |
Fabrication Node - | Fabrication Node N4P |
Die Size - | Die Size 115mm² |
Transistor Count - | Transistor Count 16 Billion |
Transistor Density - | Transistor Density 139 MTr/mm² |