Imagination PowerVR GE8322 550MHz vs Qualcomm Adreno 830 Full Specs
32 Shaders 550MHz | 1,536 Shaders 1.1GHz |
Shared Memory14.9GB/s ·· | Shared Memory84.8GB/sLPDDR5X |
·· 35.2 GFLOPS | ·· 3.38 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP 5W |
PowerVR GE8322 550MHz70.4 GFLOPSFP16
Adreno 8306.76 TFLOPSFP16Clock Speed ·· | Clock Speed ·· |
Peak OPS 70.4 GFLOPSFP16 | Peak OPS 6.76 TFLOPSFP16 |
- | BF16 6.76 TFLOPS |
FP32 35.2 GFLOPS | FP32 3.38 TFLOPS |
- | FP64 844.8 GFLOPS |
Pixel Rate 1.1 GPixel/s | Pixel Rate 52.8 GPixel/s |
Texture Rate 1.1 GTexel/s | Texture Rate 105.6 GTexel/s |
Shaders 32 Shaders | Shaders 1,536 Shaders |
TMUs 2 TMUs | TMUs 96 TMUs |
ROPs 2 ROPs | ROPs 48 ROPs |
EUs 2 EUs | EUs 12 EUs |
Boost Clock 550MHz | Boost Clock 1.1GHz |
L2 Cache - | L2 Cache 1MB shared |
L3 Cache - | L3 Cache 4MB shared |
Shared Memory ·· | Shared MemoryLPDDR5X |
Memory Bus 32-bit | Memory Bus 64-bit |
Memory Speed 3.7GT/s | Memory Speed 10.6GT/s |
Memory Bandwidth 14.9GB/s | Memory Bandwidth 84.8GB/s |
TDP Shared | TDP 5W |
Multi-Monitor - | Multi-Monitor 1 |
- | Encoder Model Hexagon |
- | Decoder Model Hexagon AV1 |
Form Factor iGPU | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Series8XEP | Codename - |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Feb 1, 2019 | Release Date Oct 1, 2024 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 28nm LP | Fabrication Node N3E |
Die Size - | Die Size 124mm² |
No images available
No images available
CPUs | CPUs |
Smartphones - | Smartphones |