Imagination PowerVR GE9000

PowerVR GE9000

Intel GMA 3600 400MHz

GMA 3600 400MHz

Imagination PowerVR GE9000 vs Intel GMA 3600 400MHz Full Specs

8 Shaders
650MHz
8 Shaders
400MHz
Shared Memory
Shared Memory4.3GB/sDDR3
··
10.4 GFLOPS
··
6.4 GFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

PowerVR GE9000PowerVR GE900020.8 GFLOPSFP16
x3.25
GMA 3600 400MHzGMA 3600 400MHz6.4 GFLOPSFP32
x1

Clock Speed
··
Clock Speed
··
Peak OPS
20.8 GFLOPSFP16
Peak OPS
6.4 GFLOPSFP32
FP32
10.4 GFLOPS
FP32
6.4 GFLOPS
Pixel Rate
0.7 GPixel/s
Pixel Rate
0.8 GPixel/s
Texture Rate
0.7 GTexel/s
Texture Rate
0.8 GTexel/s

Shaders
8 Shaders
Shaders
8 Shaders
TMUs
1 TMU
TMUs
2 TMUs
ROPs
1 ROP
ROPs
2 ROPs
EU
1 EU
EUs
4 EUs

Boost Clock
650MHz
Boost Clock
400MHz

Shared Memory
Shared MemoryDDR3
Memory Bus
-
Memory Bus
32-bit
Memory Speed
-
Memory Speed
1.1GT/s
Memory Bandwidth
-
Memory Bandwidth
4.3GB/s
ECC
No
ECC
No

Max Resolution
-
Max Resolution
1920x1200
Refresh Rate Calculator
-
Refresh Rate Calculator
1920x1080
Resolution1080p FHD
Refresh Rate
66Hz
Multi-Monitor
-
Multi-Monitor
1
DSC
Not Supported
DSC
Not Supported

Shader Model
-
Shader Model
3
-
DirectX
DirectX 10
Direct3D
10_0
-
OpenGL
3.2

-
Encoder
Clear Video
Codec
-
Codec
VC-1
AVC (H.264)

-
Decoder
Clear Video

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
PowerVR 2013 branding
Branding
GMA 2006 branding
Codename
Series9XE
Codename
Series5
Chip Variant
-
Chip Variant
SGX545
Market Segment
Smartphone
Market Segment
Tablet
Release Date
Sep 1, 2017
Release Date
May 4, 2010

Foundry
-
Foundry
Intel
Fabrication Node
-
Fabrication Node
32nm
Die Size
-
Die Size
66mm²
Transistor Count
-
Transistor Count
176M
Transistor Density
-
Transistor Density
3 MTr/mm²