GPUs

Intel Arc A370M vs NVIDIA GeForce RTX 3050 Laptop 50W Full Specs

1,024 Shaders
1.55GHz
2,048 Shaders
1.42GHz
4GB GDDR6112GB/s
4GB GDDR6192GB/s
··
3.17 TFLOPS
··
5.8 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
35W
TDP
50W

Arc A370MArc A370M101.6 TOPSINT4 Tensor
x1
GeForce RTX 3050 Laptop 50WGeForce RTX 3050 Laptop 50W185.7 TOPSINT4 Tensor Sparse
x1.83

Clock Speed
···
Clock Speed
···
Peak OPS
101.6 TOPSINT4 Tensor
Peak OPS
185.7 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
25.4 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
23.22 TFLOPS
FP16-16 Tensor Sparse
46.43 TFLOPS
Tensor FP16-32
11.61 TFLOPS
FP16-32 Tensor Sparse
23.22 TFLOPS
BF16
-
Tensor BF16
25.4 TFLOPS
BF16 Tensor Sparse
-
BF16
5.8 TFLOPS
Tensor BF16
11.61 TFLOPS
BF16 Tensor Sparse
23.22 TFLOPS
Tensor TF32
-
Tensor TF32
5.8 TFLOPS
FP32
3.17 TFLOPS
FP32
5.8 TFLOPS
FP64
793.6 GFLOPS
FP64
90.69 GFLOPS
Tensor INT4
101.6 TOPS
Tensor INT4
92.86 TOPS
Tensor INT8
50.79 TOPS
Tensor INT8
46.43 TOPS
Ray
-
Ray
8.75 TOPS
Pixel Rate
49.6 GPixel/s
Pixel Rate
45.3 GPixel/s
Texture Rate
99.2 GTexel/s
Texture Rate
90.7 GTexel/s

Shaders
1,024 Shaders
Shaders
2,048 Shaders
TMUs
64 TMUs
TMUs
64 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
128 T-Cores
Tensor Cores
64 T-Cores
RT Cores
8 RT-Cores
RT Cores
16 RT-Cores
EUs
128 EUs
SMs
16 SMs

Base Clock
300MHz
Base Clock
1.19GHz
Boost Clock
1.55GHz
Boost Clock
1.42GHz

L2 Cache
4.1MB shared
L2 Cache
2MB shared

4GB GDDR6
4GB GDDR6
Memory Bus
64-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
12GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
192GB/s
ECC
No
ECC
No

TDP
35W
TDP
50W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Arc
Encoder Model
NVENC 7

Decoder Model
Arc
Decoder Model
NVDEC 5

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV177
Chip Variant
DG2-128
Chip Variant
GA107-140-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 30, 2022
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
157mm²
Die Size
200mm²
Transistor Count
7.2 Billion
Transistor Count
8.7 Billion
Transistor Density
45.86 MTr/mm²
Transistor Density
43.5 MTr/mm²

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