Intel Arc A750 vs XFX Radeon RX 6800 Speedster QICK 319 Full Specs
3,584 Shaders 2.4GHz | 3,840 Shaders 2.19GHz |
8GB GDDR6512GB/s | 16GB GDDR6512GB/s |
·· 17.2 TFLOPS | ·· 16.82 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 225W | TDP 250W |
Power Connectors - | Power Connectors 2x 8-Pin |
Arc A750550.5 TOPSINT4 Tensor
Radeon RX 6800 Speedster QICK 31933.64 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 550.5 TOPSINT4 Tensor | Peak OPS 33.64 TFLOPSFP16 |
Tensor FP16-32 137.6 TFLOPS | - |
Tensor BF16 137.6 TFLOPS | - |
FP32 17.2 TFLOPS | FP32 16.82 TFLOPS |
FP64 4.3 TFLOPS | FP64 1.05 TFLOPS |
Tensor INT4 550.5 TOPS | Tensor INT4 - |
Tensor INT8 275.3 TOPS | - |
Pixel Rate 268.8 GPixel/s | Pixel Rate 210.2 GPixel/s |
Texture Rate 537.6 GTexel/s | Texture Rate 525.6 GTexel/s |
Shaders 3,584 Shaders | Shaders 3,840 Shaders |
TMUs 224 TMUs | TMUs 240 TMUs |
ROPs 112 ROPs | ROPs 96 ROPs |
Tensor Cores 448 T-Cores | Tensor Cores - |
RT Cores 28 RT-Cores | RT Cores 60 RT-Cores |
EUs 448 EUs | CUs 60 CUs |
Base Clock 2.05GHz | Base Clock 1.85GHz |
Boost Clock 2.4GHz | Boost Clock 2.19GHz |
L2 Cache 8.2MB shared | L2 Cache 4.1MB shared |
L3 Cache - | L3 Cache 128MB shared |
L3 Bandwidth - | L3 Bandwidth 1.66TB/s |
8GB GDDR6 | 16GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 16GT/s | Memory Speed 16GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 512GB/s |
TDP 225W | TDP 250W |
Max Temp - | Max Temp 110°C Max |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.0 | - |
- | 3x DisplayPort 1.4 |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model VCN 3.0 |
Decoder Model Arc | Decoder Model VCN 3.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2.7-Slots |
Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") | Height 138 mm (5.43")Width 340 mm (13.39")Depth 54 mm (2.13") |
Cooling Open-Air 2x Fans | Cooling Open-Air 3x Fans |
Power Connectors - | Power Connectors 2x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe HPG | Codename Sienna Cichlid |
Chip Variant DG2-512 | Chip Variant Navi 21 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Oct 14, 2022 | Release Date Nov 18, 2020 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N7 |
Die Size 406mm² | Die Size 520mm² |
Transistor Count 21.7 Billion | Transistor Count 26.8 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 51.56 MTr/mm² |
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