Intel Arc A770 vs XFX Radeon RX 6700 XT Speedster MERC 319 Full Specs
4,096 Shaders 2.4GHz | 2,560 Shaders 2.62GHz |
8GB GDDR6512GB/s | 12GB GDDR6384GB/s |
·· 19.66 TFLOPS | ·· 13.42 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 225W | TDP 230W |
Power Connectors - | Power Connectors 2x 8-Pin |
Arc A770629.1 TOPSINT4 Tensor
Radeon RX 6700 XT Speedster MERC 31926.85 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 629.1 TOPSINT4 Tensor | Peak OPS 26.85 TFLOPSFP16 |
Tensor FP16-32 157.3 TFLOPS | - |
Tensor BF16 157.3 TFLOPS | - |
FP32 19.66 TFLOPS | FP32 13.42 TFLOPS |
FP64 4.92 TFLOPS | FP64 839 GFLOPS |
Tensor INT4 629.1 TOPS | Tensor INT4 - |
Tensor INT8 314.6 TOPS | - |
Pixel Rate 307.2 GPixel/s | Pixel Rate 167.8 GPixel/s |
Texture Rate 614.4 GTexel/s | Texture Rate 419.5 GTexel/s |
Shaders 4,096 Shaders | Shaders 2,560 Shaders |
TMUs 256 TMUs | TMUs 160 TMUs |
ROPs 128 ROPs | ROPs 64 ROPs |
Tensor Cores 512 T-Cores | Tensor Cores - |
RT Cores 32 RT-Cores | RT Cores 40 RT-Cores |
EUs 512 EUs | CUs 40 CUs |
Base Clock 2.1GHz | Base Clock 2.46GHz |
Boost Clock 2.4GHz | Boost Clock 2.62GHz |
L2 Cache 8.2MB shared | L2 Cache 3.1MB shared |
L3 Cache - | L3 Cache 96MB shared |
L3 Bandwidth - | L3 Bandwidth 1.25TB/s |
8GB GDDR6 | 12GB GDDR6 |
Memory Bus 256-bit | Memory Bus 192-bit |
Memory Speed 16GT/s | Memory Speed 16GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 384GB/s |
TDP 225W | TDP 230W |
Max Temp - | Max Temp 110°C Max |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.0 | - |
- | 3x DisplayPort 1.4 |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model VCN 3.0 |
Decoder Model Arc | Decoder Model VCN 3.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2.5-Slots |
Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") | Height 132 mm (5.2")Width 323 mm (12.72")Depth 51 mm (2.01") |
Cooling Open-Air 2x Fans | Cooling Open-Air 3x Fans |
Power Connectors - | Power Connectors 2x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe HPG | Codename Navy Flounder |
Chip Variant DG2-512 | Chip Variant Navi 22 XT |
Market Segment Desktop | Market Segment Desktop |
Release Date Oct 14, 2022 | Release Date Mar 18, 2021 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N7 |
Die Size 406mm² | Die Size 335mm² |
Transistor Count 21.7 Billion | Transistor Count 17.2 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 51.34 MTr/mm² |
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