Intel Arc A770M vs NVIDIA GeForce RTX 3070 Laptop 90W Full Specs
4,096 Shaders 1.65GHz | 5,120 Shaders 1.41GHz |
16GB GDDR6512GB/s | 8GB GDDR6384GB/s |
·· 13.52 TFLOPS | ·· 14.44 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 120W | TDP 90W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 432.5 TOPSINT4 Tensor | Peak OPS 462 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 108.1 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 57.75 TFLOPSFP16-16 Tensor Sparse 115.5 TFLOPSTensor FP16-32 28.88 TFLOPSFP16-32 Tensor Sparse 57.75 TFLOPS |
BF16 -Tensor BF16 108.1 TFLOPSBF16 Tensor Sparse - | BF16 14.44 TFLOPSTensor BF16 28.88 TFLOPSBF16 Tensor Sparse 57.75 TFLOPS |
Tensor TF32 - | Tensor TF32 14.44 TFLOPS |
FP32 13.52 TFLOPS | FP32 14.44 TFLOPS |
FP64 3.38 TFLOPS | FP64 225.6 GFLOPS |
Tensor INT4 432.5 TOPS | Tensor INT4 231 TOPS |
Tensor INT8 216.3 TOPS | Tensor INT8 115.5 TOPS |
Ray - | Ray 21.78 TOPS |
Pixel Rate 211.2 GPixel/s | Pixel Rate 112.8 GPixel/s |
Texture Rate 422.4 GTexel/s | Texture Rate 225.6 GTexel/s |
Shaders 4,096 Shaders | Shaders 5,120 Shaders |
TMUs 256 TMUs | TMUs 160 TMUs |
ROPs 128 ROPs | ROPs 80 ROPs |
Tensor Cores 512 T-Cores | Tensor Cores 160 T-Cores |
RT Cores 32 RT-Cores | RT Cores 40 RT-Cores |
EUs 512 EUs | SMs 40 SMs |
Base Clock 300MHz | Base Clock 930MHz |
Boost Clock 1.65GHz | Boost Clock 1.41GHz |
L2 Cache 8.2MB shared | L2 Cache 4.1MB shared |
16GB GDDR6 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 16GT/s | Memory Speed 12GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 384GB/s |
TDP 120W | TDP 90W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 5 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV174 |
Chip Variant DG2-512 | Chip Variant GA104-150-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 28, 2022 | Release Date Jan 12, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 406mm² | Die Size 393mm² |
Transistor Count 21.7 Billion | Transistor Count 17.4 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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