GPUs

Intel Arc A770M vs NVIDIA GeForce RTX 3070 Laptop 90W Full Specs

4,096 Shaders
1.65GHz
5,120 Shaders
1.41GHz
16GB GDDR6512GB/s
8GB GDDR6384GB/s
··
13.52 TFLOPS
··
14.44 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
120W
TDP
90W

Arc A770MArc A770M432.5 TOPSINT4 Tensor
x1
GeForce RTX 3070 Laptop 90WGeForce RTX 3070 Laptop 90W462 TOPSINT4 Tensor Sparse
x1.07

Clock Speed
···
Clock Speed
···
Peak OPS
432.5 TOPSINT4 Tensor
Peak OPS
462 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
108.1 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
57.75 TFLOPS
FP16-16 Tensor Sparse
115.5 TFLOPS
Tensor FP16-32
28.88 TFLOPS
FP16-32 Tensor Sparse
57.75 TFLOPS
BF16
-
Tensor BF16
108.1 TFLOPS
BF16 Tensor Sparse
-
BF16
14.44 TFLOPS
Tensor BF16
28.88 TFLOPS
BF16 Tensor Sparse
57.75 TFLOPS
Tensor TF32
-
Tensor TF32
14.44 TFLOPS
FP32
13.52 TFLOPS
FP32
14.44 TFLOPS
FP64
3.38 TFLOPS
FP64
225.6 GFLOPS
Tensor INT4
432.5 TOPS
Tensor INT4
231 TOPS
Tensor INT8
216.3 TOPS
Tensor INT8
115.5 TOPS
Ray
-
Ray
21.78 TOPS
Pixel Rate
211.2 GPixel/s
Pixel Rate
112.8 GPixel/s
Texture Rate
422.4 GTexel/s
Texture Rate
225.6 GTexel/s

Shaders
4,096 Shaders
Shaders
5,120 Shaders
TMUs
256 TMUs
TMUs
160 TMUs
ROPs
128 ROPs
ROPs
80 ROPs
Tensor Cores
512 T-Cores
Tensor Cores
160 T-Cores
RT Cores
32 RT-Cores
RT Cores
40 RT-Cores
EUs
512 EUs
SMs
40 SMs

Base Clock
300MHz
Base Clock
930MHz
Boost Clock
1.65GHz
Boost Clock
1.41GHz

L2 Cache
8.2MB shared
L2 Cache
4.1MB shared

16GB GDDR6
8GB GDDR6
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
16GT/s
Memory Speed
12GT/s
Memory Bandwidth
512GB/s
Memory Bandwidth
384GB/s

TDP
120W
TDP
90W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Arc
Encoder Model
NVENC 7

Decoder Model
Arc
Decoder Model
NVDEC 5

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV174
Chip Variant
DG2-512
Chip Variant
GA104-150-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 28, 2022
Release Date
Jan 12, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
406mm²
Die Size
393mm²
Transistor Count
21.7 Billion
Transistor Count
17.4 Billion
Transistor Density
53.45 MTr/mm²
Transistor Density
44.33 MTr/mm²

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