Intel Arc B570 vs AMD Radeon RX 7600 Full Specs
2,304 Shaders 2.5GHz | 2,048 Shaders 2.25GHz |
10GB GDDR6380GB/s | 8GB GDDR6288GB/s |
·· 11.52 TFLOPS | ·· 18.43 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 150W | TDP 165W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 368.6 TOPSINT4 Tensor | Peak OPS 73.73 TOPSINT4 Tensor |
Tensor FP16-16 -Tensor FP16-32 92.16 TFLOPS | Tensor FP16-16 18.43 TFLOPSTensor FP16-32 18.43 TFLOPS |
BF16 -Tensor BF16 92.16 TFLOPS | BF16 36.86 TFLOPSTensor BF16 18.43 TFLOPS |
FP32 11.52 TFLOPS | FP32 18.43 TFLOPS |
FP64 2.88 TFLOPS | FP64 576 GFLOPS |
Tensor INT4 368.6 TOPS | Tensor INT4 73.73 TOPS |
Tensor INT8 184.3 TOPS | Tensor INT8 18.43 TOPS |
Pixel Rate 180 GPixel/s | Pixel Rate 144 GPixel/s |
Texture Rate 360 GTexel/s | Texture Rate 288 GTexel/s |
Shaders 2,304 Shaders | Shaders 2,048 Shaders |
TMUs 144 TMUs | TMUs 128 TMUs |
ROPs 72 ROPs | ROPs 64 ROPs |
Tensor Cores 144 T-Cores | Tensor Cores 64 T-Cores |
RT Cores 18 RT-Cores | RT Cores 32 RT-Cores |
EUs 144 EUs | CUs 32 CUs |
Base Clock - | Base Clock 1.72GHz |
Boost Clock 2.5GHz | Boost Clock 2.25GHz |
L2 Cache 18.4MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.16TB/s |
10GB GDDR6 | 8GB GDDR6 |
Memory Bus 160-bit | Memory Bus 128-bit |
Memory Speed 19GT/s | Memory Speed 18GT/s |
Memory Bandwidth 380GB/s | Memory Bandwidth 288GB/s |
TDP 150W | TDP 165W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.1 | 3x DisplayPort 2.1 |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model VCN 4.0 |
Decoder Model Arc | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 115 mm (4.53")Width 272 mm (10.71")Depth 40 mm (1.57") | Height 115 mm (4.53")Width 204 mm (8.03")Depth 40 mm (1.57") |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe2 HPG | Codename Hotpink Bonefish |
Chip Variant - | Chip Variant Navi 33 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Dec 3, 2024 | Release Date May 25, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N5 | Fabrication Node N6 |
Die Size 272mm² | Die Size 204mm² |
Transistor Count 19.6 Billion | Transistor Count 13.3 Billion |
Transistor Density 72.06 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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