Intel Arc Pro B50 vs Intel Arc Pro B60 Full Specs
2,048 Shaders 2.6GHz | 2,560 Shaders 2.4GHz |
16GB GDDR6224GB/s | 24GB GDDR6456GB/s |
·· 10.65 TFLOPS | ·· 12.29 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 200W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Arc Pro B50340.8 TOPSINT4 Tensor
Arc Pro B60393.2 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 340.8 TOPSINT4 Tensor | Peak OPS 393.2 TOPSINT4 Tensor |
Tensor FP16-32 85.2 TFLOPS | Tensor FP16-32 98.3 TFLOPS |
Tensor BF16 85.2 TFLOPS | Tensor BF16 98.3 TFLOPS |
FP32 10.65 TFLOPS | FP32 12.29 TFLOPS |
FP64 2.66 TFLOPS | FP64 3.07 TFLOPS |
Tensor INT4 340.8 TOPS | Tensor INT4 393.2 TOPS |
Tensor INT8 170.4 TOPS | Tensor INT8 196.6 TOPS |
Pixel Rate 166.4 GPixel/s | Pixel Rate 192 GPixel/s |
Texture Rate 332.8 GTexel/s | Texture Rate 384 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,560 Shaders |
TMUs 128 TMUs | TMUs 160 TMUs |
ROPs 64 ROPs | ROPs 80 ROPs |
Tensor Cores 128 T-Cores | Tensor Cores 160 T-Cores |
RT Cores 16 RT-Cores | RT Cores 20 RT-Cores |
EUs 128 EUs | EUs 160 EUs |
Base Clock 2GHz | Base Clock 2GHz |
Boost Clock 2.6GHz | Boost Clock 2.4GHz |
L2 Cache 18.4MB shared | L2 Cache 18.4MB shared |
16GB GDDR6 | 24GB GDDR6 |
Memory Bus 128-bit | Memory Bus 192-bit |
Memory Speed 14GT/s | Memory Speed 19GT/s |
Memory Bandwidth 224GB/s | Memory Bandwidth 456GB/s |
TDP 70W | TDP 200W |
Multi-Monitor 4 | Multi-Monitor 4 |
4x Mini DisplayPort 2.1 | 4x Mini DisplayPort 2.1 |
Encoder Model Arc | Encoder Model Arc |
Decoder Model Arc | Decoder Model Arc |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 69 mm (2.72")Width 168 mm (6.61")Depth 40 mm (1.57") | Height 111 mm (4.37")Width 222 mm (8.74")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding |
Codename Xe2 HPG | Codename Xe2 HPG |
Market Segment Workstation | Market Segment Workstation |
Release Date May 19, 2025 | Release Date May 19, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N5 | Fabrication Node N5 |
Die Size 272mm² | Die Size 272mm² |
Transistor Count 19.6 Billion | Transistor Count 19.6 Billion |
Transistor Density 72.06 MTr/mm² | Transistor Density 72.06 MTr/mm² |
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