GPUs

Intel Arc Pro B60 vs AMD Radeon RX 7700 Full Specs

2,560 Shaders
2.4GHz
3,072 Shaders
2.4GHz
24GB GDDR6456GB/s
12GB GDDR6432GB/s
··
12.29 TFLOPS
··
29.49 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
200W
TDP
200W
Power Connectors
1x 8-Pin
Power Connectors
1x 8-Pin

Arc Pro B60Arc Pro B60393.2 TOPSINT4 Tensor
x3.33
Radeon RX 7700Radeon RX 7700118 TOPSINT4 Tensor
x1

Clock Speed
···
Clock Speed
···
Peak OPS
393.2 TOPSINT4 Tensor
Peak OPS
118 TOPSINT4 Tensor
Tensor FP16-16
-
Tensor FP16-32
98.3 TFLOPS
Tensor FP16-16
29.49 TFLOPS
Tensor FP16-32
29.49 TFLOPS
BF16
-
Tensor BF16
98.3 TFLOPS
BF16
58.98 TFLOPS
Tensor BF16
29.49 TFLOPS
FP32
12.29 TFLOPS
FP32
29.49 TFLOPS
FP64
3.07 TFLOPS
FP64
921.6 GFLOPS
Tensor INT4
393.2 TOPS
Tensor INT4
118 TOPS
Tensor INT8
196.6 TOPS
Tensor INT8
29.49 TOPS
Pixel Rate
192 GPixel/s
Pixel Rate
230.4 GPixel/s
Texture Rate
384 GTexel/s
Texture Rate
460.8 GTexel/s

Shaders
2,560 Shaders
Shaders
3,072 Shaders
TMUs
160 TMUs
TMUs
192 TMUs
ROPs
80 ROPs
ROPs
96 ROPs
Tensor Cores
160 T-Cores
Tensor Cores
96 T-Cores
RT Cores
20 RT-Cores
RT Cores
48 RT-Cores
EUs
160 EUs
CUs
48 CUs

Base Clock
2GHz
Base Clock
1.9GHz
Boost Clock
2.4GHz
Boost Clock
2.4GHz

L2 Cache
18.4MB shared
L2 Cache
4.1MB shared
L3 Cache
-
L3 Cache
48MB shared
L3 Bandwidth
-
L3 Bandwidth
1.69TB/s

24GB GDDR6
12GB GDDR6
Memory Bus
192-bit
Memory Bus
192-bit
Memory Speed
19GT/s
Memory Speed
18GT/s
Memory Bandwidth
456GB/s
Memory Bandwidth
432GB/s

TDP
200W
TDP
200W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 2.1
4x Mini DisplayPort 2.1
-
-
1x HDMI 2.1

Encoder Model
Arc
Encoder Model
VCN 4.0

Decoder Model
Arc
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2.5-Slots
Height
111 mm (4.37")
Width
222 mm (8.74")
Depth
40 mm (1.57")
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
50 mm (1.97")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
1x 8-Pin
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
Radeon 2023 branding
Codename
Xe2 HPG
Codename
Wheat Nas
Chip Variant
-
Chip Variant
Navi 32
Market Segment
Workstation
Market Segment
Desktop
Release Date
May 19, 2025
Release Date
Aug 25, 2023

Foundry
TSMC
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCMCD
Fabrication Node
N5
-
Fabrication Node
N5
N6MCD
Die Size
272mm²
-
Die Size
200mm²
113mm²MCD
Transistor Count
19.6 Billion
-
Transistor Count
28.1 Billion
6.2 BillionMCD
Transistor Density
72.06 MTr/mm²
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD

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