Intel Arc Pro B60 vs AMD Radeon PRO W7700 Full Specs
2,560 Shaders 2.4GHz | 3,072 Shaders 2.6GHz |
24GB GDDR6456GB/s | 16GB GDDR6576GB/s |
·· 12.29 TFLOPS | ·· 31.95 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 200W | TDP 190W |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Arc Pro B60393.2 TOPSINT4 Tensor
Radeon PRO W7700127.8 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 393.2 TOPSINT4 Tensor | Peak OPS 127.8 TOPSINT4 Tensor |
Tensor FP16-16 -Tensor FP16-32 98.3 TFLOPS | Tensor FP16-16 31.95 TFLOPSTensor FP16-32 31.95 TFLOPS |
BF16 -Tensor BF16 98.3 TFLOPS | BF16 63.9 TFLOPSTensor BF16 31.95 TFLOPS |
FP32 12.29 TFLOPS | FP32 31.95 TFLOPS |
FP64 3.07 TFLOPS | FP64 998.4 GFLOPS |
Tensor INT4 393.2 TOPS | Tensor INT4 127.8 TOPS |
Tensor INT8 196.6 TOPS | Tensor INT8 31.95 TOPS |
Pixel Rate 192 GPixel/s | Pixel Rate 249.6 GPixel/s |
Texture Rate 384 GTexel/s | Texture Rate 499.2 GTexel/s |
Shaders 2,560 Shaders | Shaders 3,072 Shaders |
TMUs 160 TMUs | TMUs 192 TMUs |
ROPs 80 ROPs | ROPs 96 ROPs |
Tensor Cores 160 T-Cores | Tensor Cores 96 T-Cores |
RT Cores 20 RT-Cores | RT Cores 48 RT-Cores |
EUs 160 EUs | CUs 48 CUs |
Base Clock 2GHz | Base Clock 1.9GHz |
Boost Clock 2.4GHz | Boost Clock 2.6GHz |
L2 Cache 18.4MB shared | L2 Cache 6.1MB shared |
L3 Cache - | L3 Cache 64MB shared |
L3 Bandwidth - | L3 Bandwidth 2.33TB/s |
24GB GDDR6 | 16GB GDDR6 |
Memory Bus 192-bit | Memory Bus 256-bit |
Memory Speed 19GT/s | Memory Speed 18GT/s |
Memory Bandwidth 456GB/s | Memory Bandwidth 576GB/s |
TDP 200W | TDP 190W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
4x Mini DisplayPort 2.1 | - |
Encoder Model Arc | Encoder Model VCN 4.0 |
Decoder Model Arc | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 111 mm (4.37")Width 222 mm (8.74")Depth 40 mm (1.57") | Height 111 mm (4.37")Width 241 mm (9.49")Depth 40 mm (1.57") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 8-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe2 HPG | Codename Wheat Nas |
Chip Variant - | Chip Variant Navi 32 |
Market Segment Workstation | Market Segment Workstation |
Release Date May 19, 2025 | Release Date Nov 13, 2023 |
Foundry TSMC | Foundry TSMC |
Other Foundries - | Other Foundries TSMCMCD |
Fabrication Node N5 - | Fabrication Node N5 N6MCD |
Die Size 272mm² - | Die Size 200mm² 150mm²MCD |
Transistor Count 19.6 Billion - | Transistor Count 28.1 Billion 8.2 BillionMCD |
Transistor Density 72.06 MTr/mm² - | Transistor Density 140.5 MTr/mm² 54.67 MTr/mm²MCD |
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