Intel Graphics 4C 2300MHz vs NVIDIA GeForce MX450 GDDR6 Full Specs

Summary

512 Shaders 2.3GHz	896 Shaders 1.57GHz
Shared Memory136.5GB/s LPDDR5X·DDR5	2GB GDDR680GB/s placeholder
Peak·FP32·FP16 2.35 TFLOPS	Peak·FP32·FP16 2.82 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 31W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 4C 2300MHz75.37 TOPSINT4 Tensor

x13.35

GeForce MX450 GDDR65.64 TFLOPSFP16

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed1575MHz UC·Base·Boost·OC
Peak OPS 75.37 TOPSINT4 Tensor	Peak OPS 5.64 TFLOPSFP16
Tensor FP16-32 18.84 TFLOPS	-
Tensor BF16 18.84 TFLOPS	-
FP32 2.35 TFLOPS	FP32 2.82 TFLOPS
FP64 588.8 GFLOPS	FP64 88.2 GFLOPS
Tensor INT4 75.37 TOPS	Tensor INT4 -
Tensor INT8 37.68 TOPS	-
Pixel Rate 36.8 GPixel/s	Pixel Rate 50.4 GPixel/s
Texture Rate 73.6 GTexel/s	Texture Rate 88.2 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 896 Shaders
TMUs 32 TMUs	TMUs 56 TMUs
ROPs 16 ROPs	ROPs 32 ROPs
Tensor Cores 32 T-Cores	Tensor Cores -
RT Cores 4 RT-Cores	RT Cores -
EUs 32 EUs	SMs 14 SMs

Clocks

Base Clock -	Base Clock 1.4GHz
Boost Clock 2.3GHz	Boost Clock 1.57GHz

Cache

L2 Cache 4.1MB shared

L2 Cache 1MB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR6 placeholder
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 8.5GT/s	Memory Speed 10GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 80GB/s

Power & Thermals

TDP Shared

TDP 31W

Video Output

Multi-Monitor 3	Multi-Monitor 2
HDCP -	HDCP HDCP 2.2

Encoder

Encoder Model Xe Media Engine

-

Decoder

Decoder Model Xe Media Engine

-

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Turing
Family Gen 13	Family GeForce MX
Branding	Branding
Codename Xe3 LPG	Codename NV167
Chip Variant GT1	Chip Variant TU117-150-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Aug 1, 2020

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node 12FFN
Die Size 27mm²	Die Size 200mm²
Transistor Count -	Transistor Count 4.7 Billion
Transistor Density -	Transistor Density 23.5 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 5 336H	CPUs -
Laptops -	Laptops IdeaPad 5 Pro 14(Gen 6, Early 2021)
All-in-Ones -	All-in-Ones Pavilion 27(Early 2022)

Competitors

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NVIDIAGeForce MX450 GDDR6 vs GPU Apple8-Core M5-FL NVIDIAGeForce MX450 GDDR6 vs GPU Apple9-Core M4-FL NVIDIAGeForce MX450 GDDR6 vs GPU Apple6-Core A19 Pro Show 12 more