NVIDIA GeForce MX450 GDDR6 vs Apple 6-Core A19 Pro Full Specs

Summary

896 Shaders 1.57GHz	768 Shaders 1.62GHz
2GB GDDR680GB/s placeholder	Shared Memory76.8GB/sLPDDR5X
Peak·FP32·FP16 2.82 TFLOPS	Peak·FP32·FP16 2.49 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 31W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP8-16 Tensor FP8-32 Tensor FP16-16 Tensor FP16-32 FP64 Memory Bandwidth TDP

GeForce MX450 GDDR65.64 TFLOPSFP16

x1.13

6-Core A19 Pro4.98 TFLOPSFP8-16 Tensor

x1

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Theoretical Performance

Clock Speed1575MHz UC·Base·Boost·OC	Clock Speed1620MHz UC·Boost·OC
Peak OPS 5.64 TFLOPSFP16	Peak OPS 4.98 TFLOPSFP8-16 Tensor
-	Tensor FP8-16 4.98 TFLOPS Tensor FP8-32 4.98 TFLOPS
-	Tensor FP16-16 2.49 TFLOPS Tensor FP16-32 2.49 TFLOPS
FP32 2.82 TFLOPS	FP32 2.49 TFLOPS
FP64 88.2 GFLOPS	-
Pixel Rate 50.4 GPixel/s	Pixel Rate 38.9 GPixel/s
Texture Rate 88.2 GTexel/s	Texture Rate 77.8 GTexel/s

Core Config

Shaders 896 Shaders	Shaders 768 Shaders
TMUs 56 TMUs	TMUs 48 TMUs
ROPs 32 ROPs	ROPs 24 ROPs
Tensor Cores -	Tensor Cores 6 T-Cores
RT Cores -	RT Cores 6 RT-Cores
SMs 14 SMs	EUs 96 EUs

Clocks

Base Clock 1.4GHz	Base Clock -
Boost Clock 1.57GHz	Boost Clock 1.62GHz

Cache

L2 Cache 1MB shared

L2 Cache 1MB shared

Memory

2GB GDDR6 placeholder	Shared MemoryLPDDR5X
Memory Bus 64-bit	Memory Bus 64-bit
Memory Speed 10GT/s	Memory Speed 9.6GT/s
Memory Bandwidth 80GB/s	Memory Bandwidth 76.8GB/s

Power & Thermals

TDP 31W

TDP Shared

Video Output

Multi-Monitor 2	Multi-Monitor 1
HDCP HDCP 2.2	HDCP -

Encoder

-	Encoder Model Apple Media Engine 3

Decoder

-	Decoder Model Apple Media Engine 3

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer NVIDIA	Manufacturer Apple
Chip Designer NVIDIA	Chip Designer Apple
Architecture Turing	Architecture Apple Gen 8
Family GeForce MX	Family A Series
Branding	Branding
Codename NV167	Codename G18P
Chip Variant TU117-150-A1	Chip Variant -
Market Segment Laptop	Market Segment Smartphone
Release Date Aug 1, 2020	Release Date Sep 9, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 12FFN	Fabrication Node N3P
Die Size 200mm²	Die Size 99mm²
Transistor Count 4.7 Billion	Transistor Count 17 Billion
Transistor Density 23.5 MTr/mm²	Transistor Density 172 MTr/mm²

Images

No images available

No images available

Used In

CPUs -	CPUs A19 Pro
Laptops IdeaPad 5 Pro 14(Gen 6, Early 2021)	Laptops -
Smartphones -	Smartphones iPhone 17 ProiPhone 17 Pro Max
All-in-Ones Pavilion 27(Early 2022)	All-in-Ones -

Competitors

NVIDIAGeForce MX450 GDDR6 vs GPU Apple8-Core M5-FL NVIDIAGeForce MX450 GDDR6 vs GPU Apple9-Core M4-FL NVIDIAGeForce MX450 GDDR6 vs GPU Apple8-Core M4-FL Show 12 more

Apple6-Core A19 Pro vs GPU Apple5-Core A18 Pro Apple6-Core A19 Pro vs GPU Apple5-Core A19 Pro Apple6-Core A19 Pro vs GPU Apple5-Core A19 Show 12 more