GPUs

Intel HD 630 1050MHz vs AMD Radeon 760M 2800MHz Full Specs

192 Shaders
1.05GHz
384 Shaders
2.8GHz
Shared Memory38.4GB/s
·
Shared Memory83.2GB/sDDR5
··
403.2 GFLOPS
··
2.15 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

HD 630 1050MHzHD 630 1050MHz403.2 GFLOPSFP16
x1
Radeon 760M 2800MHzRadeon 760M 2800MHz4.3 TFLOPSFP16
x10.67

Clock Speed
···
Clock Speed
···
Peak OPS
403.2 GFLOPSFP16
Peak OPS
4.3 TFLOPSFP16
-
BF16
4.3 TFLOPS
FP32
403.2 GFLOPS
FP32
2.15 TFLOPS
FP64
100.8 GFLOPS
FP64
134.4 GFLOPS
Pixel Rate
3.1 GPixel/s
Pixel Rate
44.8 GPixel/s
Texture Rate
25.2 GTexel/s
Texture Rate
67.2 GTexel/s

Shaders
192 Shaders
Shaders
384 Shaders
TMUs
24 TMUs
TMUs
24 TMUs
ROPs
3 ROPs
ROPs
16 ROPs
RT Cores
-
RT Cores
6 RT-Cores
EUs
24 EUs
CUs
6 CUs

Base Clock
350MHz
Base Clock
1.5GHz
Boost Clock
1.05GHz
Boost Clock
2.8GHz

Shared Memory
·
Shared MemoryDDR5
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.4GT/s
Memory Speed
5.2GT/s
Memory Bandwidth
38.4GB/s
Memory Bandwidth
83.2GB/s

Multi-Monitor
3
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.2

Encoder Model
Quick Sync Video 6
Encoder Model
VCN 4.0

Decoder Model
Quick Sync Video 6
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU
Cooling
Passive
Cooling
Open-Air

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
HD 2016 branding
Branding
Radeon 2023 branding
Codename
Kaby Lake
Codename
Phoenix
Chip Variant
GT1
Chip Variant
-
Market Segment
Desktop
Market Segment
Laptop
Release Date
Jan 3, 2017
Release Date
Jan 8, 2024

Foundry
Intel
Foundry
TSMC
Fabrication Node
14nm+
Fabrication Node
N4
Die Size
103mm²
Die Size
178mm²
Transistor Count
1.8 Billion
Transistor Count
25 Billion
Transistor Density
17 MTr/mm²
Transistor Density
140 MTr/mm²

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