Intel UHD 64EU 1250MHz Gen 12 vs NVIDIA GeForce RTX 3050 Laptop 80W Full Specs
512 Shaders 1.25GHz | 2,048 Shaders 1.74GHz |
Shared Memory102.4GB/s ··· | 4GB GDDR6192GB/s placeholder |
·· 1.28 TFLOPS | ·· 7.13 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP Shared | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 2.56 TFLOPSFP16 | Peak OPS 228.1 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS |
- | BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS |
Tensor TF32 - | Tensor TF32 7.13 TFLOPS |
FP32 1.28 TFLOPS | FP32 7.13 TFLOPS |
FP64 320 GFLOPS | FP64 111.4 GFLOPS |
Tensor INT4 - | Tensor INT4 114 TOPS |
- | Tensor INT8 57.02 TOPS |
Ray - | Ray 10.75 TOPS |
Pixel Rate 20 GPixel/s | Pixel Rate 55.7 GPixel/s |
Texture Rate 40 GTexel/s | Texture Rate 111.4 GTexel/s |
Shaders 512 Shaders | Shaders 2,048 Shaders |
TMUs 32 TMUs | TMUs 64 TMUs |
ROPs 16 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 16 RT-Cores |
EUs 64 EUs | SMs 16 SMs |
Base Clock 300MHz | Base Clock 1.49GHz |
Boost Clock 1.25GHz | Boost Clock 1.74GHz |
L2 Cache 512KB shared | L2 Cache 2MB shared |
L3 Cache 2MB shared | L3 Cache - |
Shared Memory ··· | 4GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 6.4GT/s | Memory Speed 12GT/s |
Memory Bandwidth 102.4GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP Shared | TDP 80W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Quick Sync Video 8 | Encoder Model NVENC 7 |
Decoder Model Quick Sync Video 8 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe LP | Codename NV177 |
Chip Variant GT1 | Chip Variant GA107-140-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 1, 2023 | Release Date May 11, 2021 |
Foundry Intel | Foundry Samsung |
Fabrication Node Intel 7 | Fabrication Node 8N |
Die Size 161mm² | Die Size 200mm² |
Transistor Count 11.9 Billion | Transistor Count 8.7 Billion |
Transistor Density 74 MTr/mm² | Transistor Density 43.5 MTr/mm² |
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