GPUs

NVIDIA GeForce GTX 260 vs AMD Radeon RX 7700 Full Specs

192 Shaders
576MHz
3,072 Shaders
2.4GHz
918MB GDDR3111.9GB/s
12GB GDDR6432GB/s
··
476.9 GFLOPS
··
29.49 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
182W
TDP
200W
Power Connectors
-
2x 6-Pin
Power Connectors
1x 8-Pin
-

GeForce GTX 260GeForce GTX 260476.9 GFLOPSFP32
x1
Radeon RX 7700Radeon RX 7700118 TOPSINT4 Tensor
x247.34

Clock Speed
··
Clock Speed
···
Peak OPS
476.9 GFLOPSFP32
Peak OPS
118 TOPSINT4 Tensor
-
Tensor FP16-16
29.49 TFLOPS
Tensor FP16-32
29.49 TFLOPS
-
BF16
58.98 TFLOPS
Tensor BF16
29.49 TFLOPS
FP32
476.9 GFLOPS
FP32
29.49 TFLOPS
FP64
59.62 GFLOPS
FP64
921.6 GFLOPS
Tensor INT4
-
Tensor INT4
118 TOPS
-
Tensor INT8
29.49 TOPS
Pixel Rate
34.8 GPixel/s
Pixel Rate
230.4 GPixel/s
Texture Rate
79.5 GTexel/s
Texture Rate
460.8 GTexel/s

Shaders
192 Shaders
Shaders
3,072 Shaders
TMUs
64 TMUs
TMUs
192 TMUs
ROPs
28 ROPs
ROPs
96 ROPs
Tensor Cores
-
Tensor Cores
96 T-Cores
RT Cores
-
RT Cores
48 RT-Cores
SMs
24 SMs
CUs
48 CUs

Base Clock
-
Base Clock
1.9GHz
Boost Clock
576MHz
Boost Clock
2.4GHz
Shader Clock
1.24GHz
Shader Clock
-

L2 Cache
256KB shared
L2 Cache
4.1MB shared
L3 Cache
-
L3 Cache
48MB shared
L3 Bandwidth
-
L3 Bandwidth
1.69TB/s

918MB GDDR3
12GB GDDR6
Memory Bus
448-bit
Memory Bus
192-bit
Memory Speed
2GT/s
Memory Speed
18GT/s
Memory Bandwidth
111.9GB/s
Memory Bandwidth
432GB/s

TDP
182W
TDP
200W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
3x DisplayPort 2.1
-
1x HDMI 2.1
2x DVI-I Dual-Link
-
1x S-Video
-

-
Encoder Model
VCN 4.0

Decoder Model
VP2
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2.5-Slots
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
38 mm (1.5")
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
50 mm (1.97")
Cooling
Blower
1x Fan
Cooling
Open-Air
2x Fans
Power Connectors
2x 6-Pin
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce 2006 branding
Branding
Radeon 2023 branding
Codename
NVA0
Codename
Wheat Nas
Chip Variant
GT200-100-A2
Chip Variant
Navi 32
Market Segment
Desktop
Market Segment
Desktop
Release Date
Jun 16, 2008
Release Date
Aug 25, 2023

Foundry
TSMC
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCMCD
Fabrication Node
65nm
-
Fabrication Node
N5
N6MCD
Die Size
576mm²
-
Die Size
200mm²
113mm²MCD
Transistor Count
1.4 Billion
-
Transistor Count
28.1 Billion
6.2 BillionMCD
Transistor Density
2.43 MTr/mm²
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD

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