NVIDIA GeForce RTX 3050 6GB vs AMD Radeon PRO W7400 Full Specs
2,304 Shaders 1.47GHz | 1,792 Shaders 1.1GHz |
6GB GDDR6168GB/s | 8GB GDDR6172.8GB/s |
·· 6.77 TFLOPS | ·· 7.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 55W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 216.8 TOPSINT4 Tensor Sparse | Peak OPS 31.54 TOPSINT4 Tensor |
Tensor FP16-16 27.1 TFLOPSFP16-16 Tensor Sparse 54.19 TFLOPSTensor FP16-32 13.55 TFLOPSFP16-32 Tensor Sparse 27.1 TFLOPS | Tensor FP16-16 7.88 TFLOPSFP16-16 Tensor Sparse -Tensor FP16-32 7.88 TFLOPSFP16-32 Tensor Sparse - |
BF16 6.77 TFLOPSTensor BF16 13.55 TFLOPSBF16 Tensor Sparse 27.1 TFLOPS | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPSBF16 Tensor Sparse - |
Tensor TF32 6.77 TFLOPS | Tensor TF32 - |
FP32 6.77 TFLOPS | FP32 7.88 TFLOPS |
FP64 105.8 GFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 108.4 TOPS | Tensor INT4 31.54 TOPS |
Tensor INT8 54.19 TOPS | Tensor INT8 7.88 TOPS |
Ray 10.22 TOPS | Ray - |
Pixel Rate 47 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 105.8 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 2,304 Shaders | Shaders 1,792 Shaders |
TMUs 72 TMUs | TMUs 112 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores 72 T-Cores | Tensor Cores 56 T-Cores |
RT Cores 18 RT-Cores | RT Cores 28 RT-Cores |
SMs 18 SMs | CUs 28 CUs |
Base Clock 1.04GHz | Base Clock 1GHz |
Boost Clock 1.47GHz | Boost Clock 1.1GHz |
L2 Cache 2MB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
6GB GDDR6 | 8GB GDDR6 |
Memory Bus 96-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 168GB/s | Memory Bandwidth 172.8GB/s |
TDP 70W | TDP 55W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
3x DisplayPort 1.4 | - |
1x HDMI 2.1 | - |
Encoder Model NVENC 7 | Encoder Model VCN 4.0 |
Decoder Model NVDEC 5 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 1.9-Slots | PCIe 1-Slots |
Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") | Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") |
Cooling Open-Air 2x Fans | Cooling Blower 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Hotpink Bonefish |
Chip Variant GA107-140-A1 | Chip Variant Navi 33 XL |
Market Segment Desktop | Market Segment Workstation |
Release Date Feb 2, 2024 | Release Date Aug 7, 2025 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 200mm² | Die Size 204mm² |
Transistor Count 8.7 Billion | Transistor Count 13.3 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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