NVIDIA GeForce RTX 3050 Laptop 50W vs Intel UHD 16EU 1450MHz Gen 12 Full Specs
2,048 Shaders 1.42GHz | 128 Shaders 1.45GHz |
4GB GDDR6192GB/s placeholder | Shared Memory76.8GB/s · |
·· 5.8 TFLOPS | ·· 371.2 GFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 50W | TDP Shared |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 185.7 TOPSINT4 Tensor Sparse | Peak OPS 742.4 GFLOPSFP16 |
Tensor FP16-16 23.22 TFLOPSFP16-16 Tensor Sparse 46.43 TFLOPSTensor FP16-32 11.61 TFLOPSFP16-32 Tensor Sparse 23.22 TFLOPS | - |
BF16 5.8 TFLOPSTensor BF16 11.61 TFLOPSBF16 Tensor Sparse 23.22 TFLOPS | - |
Tensor TF32 5.8 TFLOPS | Tensor TF32 - |
FP32 5.8 TFLOPS | FP32 371.2 GFLOPS |
FP64 90.69 GFLOPS | FP64 92.8 GFLOPS |
Tensor INT4 92.86 TOPS | Tensor INT4 - |
Tensor INT8 46.43 TOPS | - |
Ray 8.75 TOPS | Ray - |
Pixel Rate 45.3 GPixel/s | Pixel Rate 11.6 GPixel/s |
Texture Rate 90.7 GTexel/s | Texture Rate 11.6 GTexel/s |
Shaders 2,048 Shaders | Shaders 128 Shaders |
TMUs 64 TMUs | TMUs 8 TMUs |
ROPs 32 ROPs | ROPs 8 ROPs |
Tensor Cores 64 T-Cores | Tensor Cores - |
RT Cores 16 RT-Cores | RT Cores - |
SMs 16 SMs | EUs 16 EUs |
Base Clock 1.19GHz | Base Clock - |
Boost Clock 1.42GHz | Boost Clock 1.45GHz |
L2 Cache 2MB shared | L2 Cache 224KB shared |
L3 Cache - | L3 Cache 1MB shared |
4GB GDDR6 placeholder | Shared Memory · |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 12GT/s | Memory Speed 4.8GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 76.8GB/s |
TDP 50W | TDP Shared |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 7 | Encoder Model Quick Sync Video 8 |
Decoder Model NVDEC 5 | Decoder Model Quick Sync Video 8 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Xe LP |
Chip Variant GA107-140-A1 | Chip Variant GT1 |
Market Segment Laptop | Market Segment Laptop |
Release Date May 11, 2021 | Release Date May 11, 2021 |
Foundry Samsung | Foundry Intel |
Fabrication Node 8N | Fabrication Node Intel 7 |
Die Size 200mm² | Die Size 257mm² |
Transistor Count 8.7 Billion | Transistor Count 18.5 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 72 MTr/mm² |
No images available
No images available



