GPUs

NVIDIA GeForce RTX 3050 Ti Laptop 80W vs AMD Radeon 840M 2900MHz Full Specs

2,560 Shaders
1.7GHz
256 Shaders
2.9GHz
4GB GDDR6192GB/s
Shared Memory128GB/s
·
··
8.68 TFLOPS
··
1.49 TFLOPS
Form Factor
Soldered
Form Factor
iGPU
TDP
80W
TDP
Shared

Clock Speed
···
Clock Speed
···
Peak OPS
277.7 TOPSINT4 Tensor Sparse
Peak OPS
2.97 TFLOPSFP16
Tensor FP16-16
34.71 TFLOPS
FP16-16 Tensor Sparse
69.43 TFLOPS
Tensor FP16-32
17.36 TFLOPS
FP16-32 Tensor Sparse
34.71 TFLOPS
-
BF16
8.68 TFLOPS
Tensor BF16
17.36 TFLOPS
BF16 Tensor Sparse
34.71 TFLOPS
BF16
2.97 TFLOPS
Tensor BF16
-
BF16 Tensor Sparse
-
Tensor TF32
8.68 TFLOPS
Tensor TF32
-
FP32
8.68 TFLOPS
FP32
1.49 TFLOPS
FP64
135.6 GFLOPS
FP64
92.8 GFLOPS
Tensor INT4
138.9 TOPS
Tensor INT4
-
Tensor INT8
69.43 TOPS
-
Ray
13.09 TOPS
Ray
-
Pixel Rate
54.2 GPixel/s
Pixel Rate
92.8 GPixel/s
Texture Rate
135.6 GTexel/s
Texture Rate
46.4 GTexel/s

Shaders
2,560 Shaders
Shaders
256 Shaders
TMUs
80 TMUs
TMUs
16 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
80 T-Cores
Tensor Cores
-
RT Cores
20 RT-Cores
RT Cores
4 RT-Cores
SMs
20 SMs
CUs
4 CUs

Base Clock
1.46GHz
Base Clock
1.5GHz
Boost Clock
1.7GHz
Boost Clock
2.9GHz

L2 Cache
2MB shared
L2 Cache
-

4GB GDDR6
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
12GT/s
Memory Speed
8GT/s
Memory Bandwidth
192GB/s
Memory Bandwidth
128GB/s
ECC
No
ECC
No

TDP
80W
TDP
Shared

Multi-Monitor
3
Multi-Monitor
4
HDCP
HDCP 2.3
HDCP
HDCP 2.3

Encoder Model
NVENC 7
Encoder Model
VCN 4.0
Codec
-
AVC (H.264)
HEVC (H.265)
-
Codec
VP9
AVC (H.264)
HEVC (H.265)
AV1

Decoder Model
NVDEC 5
Decoder Model
VCN 4.0
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
JPEG
VC-1
-
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce RTX 2018 branding
Branding
Radeon 2023 branding
Codename
NV177
Codename
Strix Point
Chip Variant
GA107-140-A1
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
May 11, 2021
Release Date
Jan 6, 2025

Foundry
Samsung
Foundry
TSMC
Fabrication Node
8N
Fabrication Node
N4P
Die Size
200mm²
Die Size
233mm²
Transistor Count
8.7 Billion
Transistor Count
28 Billion
Transistor Density
43.5 MTr/mm²
Transistor Density
120 MTr/mm²