NVIDIA GeForce RTX 3070 Laptop 90W vs PowerColor Radeon RX 6800 Red Dragon Full Specs
5,120 Shaders 1.41GHz | 3,840 Shaders 2.17GHz |
8GB GDDR6384GB/s | 16GB GDDR6512GB/s |
·· 14.44 TFLOPS | ·· 16.67 TFLOPS |
Form Factor Soldered | Form Factor PCIe Card |
TDP 90W | TDP 250W |
Power Connectors - | Power Connectors 2x 8-Pin |
GeForce RTX 3070 Laptop 90W462 TOPSINT4 Tensor Sparse
Radeon RX 6800 Red Dragon33.33 TFLOPSFP16Clock Speed ··· | Clock Speed ··· |
Peak OPS 462 TOPSINT4 Tensor Sparse | Peak OPS 33.33 TFLOPSFP16 |
Tensor FP16-16 57.75 TFLOPSFP16-16 Tensor Sparse 115.5 TFLOPSTensor FP16-32 28.88 TFLOPSFP16-32 Tensor Sparse 57.75 TFLOPS | - |
BF16 14.44 TFLOPSTensor BF16 28.88 TFLOPSBF16 Tensor Sparse 57.75 TFLOPS | - |
Tensor TF32 14.44 TFLOPS | Tensor TF32 - |
FP32 14.44 TFLOPS | FP32 16.67 TFLOPS |
FP64 225.6 GFLOPS | FP64 1.04 TFLOPS |
Tensor INT4 231 TOPS | Tensor INT4 - |
Tensor INT8 115.5 TOPS | - |
Ray 21.78 TOPS | Ray - |
Pixel Rate 112.8 GPixel/s | Pixel Rate 208.3 GPixel/s |
Texture Rate 225.6 GTexel/s | Texture Rate 520.8 GTexel/s |
Shaders 5,120 Shaders | Shaders 3,840 Shaders |
TMUs 160 TMUs | TMUs 240 TMUs |
ROPs 80 ROPs | ROPs 96 ROPs |
Tensor Cores 160 T-Cores | Tensor Cores - |
RT Cores 40 RT-Cores | RT Cores 60 RT-Cores |
SMs 40 SMs | CUs 60 CUs |
Base Clock 930MHz | Base Clock 1.85GHz |
Boost Clock 1.41GHz | Boost Clock 2.17GHz |
L2 Cache 4.1MB shared | L2 Cache 4.1MB shared |
L3 Cache - | L3 Cache 128MB shared |
L3 Bandwidth - | L3 Bandwidth 1.66TB/s |
8GB GDDR6 | 16GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 12GT/s | Memory Speed 16GT/s |
Memory Bandwidth 384GB/s | Memory Bandwidth 512GB/s |
TDP 90W | TDP 250W |
Max Temp - | Max Temp 110°C Max |
Multi-Monitor 3 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
- | 1x HDMI 2.1 |
Encoder Model NVENC 7 | Encoder Model VCN 3.0 |
Decoder Model NVDEC 5 | Decoder Model VCN 3.0 |
Form Factor Soldered | Form Factor PCIe Card |
PCIe - | PCIe 2.7-Slots |
- | Height 135 mm (5.32")Width 310 mm (12.2")Depth 54 mm (2.13") |
Cooling Open-Air - | Cooling Open-Air 3x Fans |
Power Connectors - | Power Connectors 2x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename NV174 | Codename Sienna Cichlid |
Chip Variant GA104-150-A1 | Chip Variant Navi 21 XL |
Market Segment Laptop | Market Segment Desktop |
Release Date Jan 12, 2021 | Release Date Nov 18, 2020 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N7 |
Die Size 393mm² | Die Size 520mm² |
Transistor Count 17.4 Billion | Transistor Count 26.8 Billion |
Transistor Density 44.33 MTr/mm² | Transistor Density 51.56 MTr/mm² |
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