NVIDIA GeForce RTX 4070 Laptop 115W vs Apple 32-Core M4 Max Full Specs
4,608 Shaders 2.17GHz | 4,096 Shaders 1.58GHz |
8GB GDDR6256GB/s placeholder | Shared Memory409.6GB/sLPDDR5X |
·· 20.04 TFLOPS | ·· 12.93 TFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 115W | TDP Shared |
Clock Speed ··· | Clock Speed ·· |
Peak OPS 641.4 TOPSINT4 Tensor Sparse | Peak OPS 12.93 TFLOPSFP16 |
Tensor FP8-16 160.4 TFLOPSFP8-16 Tensor Sparse 320.7 TFLOPSTensor FP8-32 80.18 TFLOPSFP8-32 Tensor Sparse 160.4 TFLOPS | - |
Tensor FP16-16 80.18 TFLOPSFP16-16 Tensor Sparse 160.4 TFLOPSTensor FP16-32 40.09 TFLOPSFP16-32 Tensor Sparse 80.18 TFLOPS | - |
BF16 20.04 TFLOPSTensor BF16 40.09 TFLOPSBF16 Tensor Sparse 80.18 TFLOPS | - |
Tensor TF32 20.04 TFLOPS | Tensor TF32 - |
FP32 20.04 TFLOPS | FP32 12.93 TFLOPS |
FP64 313.2 GFLOPS | - |
Tensor INT4 320.7 TOPS | Tensor INT4 - |
Tensor INT8 160.4 TOPS | - |
Ray 46.33 TOPS | Ray - |
Pixel Rate 104.4 GPixel/s | Pixel Rate 202 GPixel/s |
Texture Rate 313.2 GTexel/s | Texture Rate 404 GTexel/s |
Shaders 4,608 Shaders | Shaders 4,096 Shaders |
TMUs 144 TMUs | TMUs 256 TMUs |
ROPs 48 ROPs | ROPs 128 ROPs |
Tensor Cores 144 T-Cores | Tensor Cores - |
RT Cores 36 RT-Cores | RT Cores 32 RT-Cores |
SMs 36 SMs | EUs 512 EUs |
Base Clock 2.07GHz | Base Clock - |
Boost Clock 2.17GHz | Boost Clock 1.58GHz |
L2 Cache 32.8MB shared | L2 Cache 8.2MB shared |
8GB GDDR6 placeholder | Shared MemoryLPDDR5X |
Memory Bus 128-bit | Memory Bus 384-bit |
Memory Speed 16GT/s | Memory Speed 8.5GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 409.6GB/s |
ECC No | ECC No |
TDP 115W | TDP Shared |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP HDCP 2.3 | HDCP - |
Encoder Model NVENC 8 | Encoder Model 2x Apple Media Engine 3 |
Decoder Model NVDEC 5 | Decoder Model 2x Apple Media Engine 3 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV186 | Codename G16M |
Chip Variant AD106-350-A1 | Chip Variant - |
Market Segment Laptop | Market Segment Laptop |
Release Date Feb 22, 2023 | Release Date Oct 30, 2024 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 4N | Fabrication Node N3E |
Die Size 188mm² | Die Size 454mm² |
Transistor Count 22.9 Billion | Transistor Count 76 Billion |
Transistor Density 121.8 MTr/mm² | Transistor Density 167 MTr/mm² |
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