GPUs

NVIDIA GRID M60-2Q vs AMD Radeon PRO W7400 Full Specs

2,048 Shaders
557MHz
1,792 Shaders
1.1GHz
2GB GDDR5160.4GB/s
8GB GDDR6172.8GB/s
··
2.28 TFLOPS
··
7.88 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
225W
TDP
55W
Power Connectors
1x 8-Pin
Power Connectors
-

GRID M60-2QGRID M60-2Q2.28 TFLOPSFP32
x1
Radeon PRO W7400Radeon PRO W740031.54 TOPSINT4 Tensor
x13.82

Clock Speed
··
Clock Speed
···
Peak OPS
2.28 TFLOPSFP32
Peak OPS
31.54 TOPSINT4 Tensor
-
Tensor FP16-16
7.88 TFLOPS
Tensor FP16-32
7.88 TFLOPS
-
BF16
15.77 TFLOPS
Tensor BF16
7.88 TFLOPS
FP32
2.28 TFLOPS
FP32
7.88 TFLOPS
FP64
71.3 GFLOPS
FP64
246.4 GFLOPS
Tensor INT4
-
Tensor INT4
31.54 TOPS
-
Tensor INT8
7.88 TOPS
Pixel Rate
35.6 GPixel/s
Pixel Rate
70.4 GPixel/s
Texture Rate
71.3 GTexel/s
Texture Rate
123.2 GTexel/s

Shaders
2,048 Shaders
Shaders
1,792 Shaders
TMUs
128 TMUs
TMUs
112 TMUs
ROPs
64 ROPs
ROPs
64 ROPs
Tensor Cores
-
Tensor Cores
56 T-Cores
RT Cores
-
RT Cores
28 RT-Cores
SMs
16 SMs
CUs
28 CUs

Base Clock
-
Base Clock
1GHz
Boost Clock
557MHz
Boost Clock
1.1GHz

L2 Cache
2MB shared
L2 Cache
2MB shared
L3 Cache
-
L3 Cache
32MB shared
L3 Bandwidth
-
L3 Bandwidth
1.17TB/s

2GB GDDR5
8GB GDDR6
Memory Bus
256-bit
Memory Bus
128-bit
Memory Speed
5GT/s
Memory Speed
10.8GT/s
Memory Bandwidth
160.4GB/s
Memory Bandwidth
172.8GB/s

TDP
225W
TDP
55W

Multi-Monitor
-
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
4x DisplayPort 2.1

Encoder Model
2x NVENC 3
Encoder Model
VCN 4.0

Decoder Model
NVDEC 1
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
1-Slots
Height
111 mm (4.37")
Width
267 mm (10.51")
Depth
40 mm (1.57")
Height
115 mm (4.53")
Width
216 mm (8.5")
Depth
20 mm (0.79")
Cooling
Passive
-
Cooling
Blower
1x Fan
Power Connectors
1x 8-Pin
Power Connectors
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GRID branding
Branding
Radeon Pro 2023 branding
Codename
NV124
Codename
Hotpink Bonefish
Chip Variant
-
Chip Variant
Navi 33 XL
Market Segment
Server
Market Segment
Workstation
Release Date
Aug 30, 2015
Release Date
Aug 7, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
28nm
Fabrication Node
N6
Die Size
398mm²
Die Size
204mm²
Transistor Count
5.2 Billion
Transistor Count
13.3 Billion
Transistor Density
13.07 MTr/mm²
Transistor Density
65.2 MTr/mm²

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