NVIDIA RSX-3 vs AMD Liverpool Full Specs
24 Shaders 550MHz | 1,152 Shaders 800MHz |
262MB GDDR320.8GB/s | Shared Memory |
·· 192 GFLOPS | ·· 1.84 TFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 35W | TDP 75W |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 192 GFLOPSFP32 | Peak OPS 1.84 TFLOPSFP32 |
FP32 192 GFLOPS | FP32 1.84 TFLOPS |
Pixel Rate 4.4 GPixel/s | Pixel Rate 25.6 GPixel/s |
Texture Rate 13.2 GTexel/s | Texture Rate 57.6 GTexel/s |
Shaders 24 Shaders | Shaders 1,152 Shaders |
TMUs 24 TMUs | TMUs 72 TMUs |
ROPs 8 ROPs | ROPs 32 ROPs |
Units - | CUs 18 CUs |
Boost Clock 550MHz | Boost Clock 800MHz |
262MB GDDR3 | Shared Memory |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 1.3GT/s | Memory Speed 5.5GT/s |
Memory Bandwidth 20.8GB/s | Memory Bandwidth 176GB/s |
ECC No | ECC No |
TDP 35W | TDP 75W |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Reality Synthesizer | Codename - |
Chip Variant RSX-CXD5302 | Chip Variant CXD90026BG |
Market Segment Console | Market Segment Console |
Release Date Oct 4, 2012 | Release Date Nov 24, 2013 |
Foundry Sony | Foundry TSMC |
Fabrication Node 40nm | Fabrication Node 28nm |
Die Size 114mm² | Die Size 348mm² |
Transistor Count 302 Million | Transistor Count - |
Transistor Density 2.65 MTr/mm² | Transistor Density - |
No images available
No images available
CPUs - | CPUs |



