NVIDIA RSX-3 vs AMD Neo Full Specs
24 Shaders 550MHz | 2,304 Shaders 911MHz |
256MB GDDR320.8GB/s | Shared Memory |
·· 192 GFLOPS | ·· 4.2 TFLOPS |
Form Factor Soldered | Form Factor iGPU |
TDP 35W | TDP 150W |
Clock Speed ·· | Clock Speed ·· |
Peak OPS 192 GFLOPSFP32 | Peak OPS 4.2 TFLOPSFP32 |
FP32 192 GFLOPS | FP32 4.2 TFLOPS |
Pixel Rate 4.4 GPixel/s | Pixel Rate 29.1 GPixel/s |
Texture Rate 13.2 GTexel/s | Texture Rate 131.2 GTexel/s |
Shaders 24 Shaders | Shaders 2,304 Shaders |
TMUs 24 TMUs | TMUs 144 TMUs |
ROPs 8 ROPs | ROPs 32 ROPs |
Units - | CUs 36 CUs |
Boost Clock 550MHz | Boost Clock 911MHz |
256MB GDDR3 | Shared Memory |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 1.3GT/s | Memory Speed 6.8GT/s |
Memory Bandwidth 20.8GB/s | Memory Bandwidth 217.6GB/s |
ECC No | ECC No |
TDP 35W | TDP 150W |
Multi-Monitor 1 | Multi-Monitor 1 |
Form Factor Soldered | Form Factor iGPU |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Reality Synthesizer | Codename - |
Chip Variant RSX-CXD5302 | Chip Variant CXD90044GB |
Market Segment Console | Market Segment Console |
Release Date Oct 4, 2012 | Release Date Nov 10, 2016 |
Foundry Sony | Foundry TSMC |
Fabrication Node 40nm | Fabrication Node 16FF |
Die Size 114mm² | Die Size 322mm² |
Transistor Count 302 Million | Transistor Count 5.7 Billion |
Transistor Density 2.65 MTr/mm² | Transistor Density 18 MTr/mm² |

