PowerColor Radeon RX 6800 Red Dragon vs AMD Radeon RX 7900 GRE Full Specs
3,840 Shaders 2.17GHz | 5,120 Shaders 2.25GHz |
16GB GDDR6512GB/s | 16GB GDDR6576GB/s |
·· 16.67 TFLOPS | ·· 45.98 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 250W | TDP 260W |
Power Connectors 2x 8-Pin | Power Connectors 2x 8-Pin |
Radeon RX 6800 Red Dragon33.33 TFLOPSFP16
Radeon RX 7900 GRE183.9 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 33.33 TFLOPSFP16 | Peak OPS 183.9 TOPSINT4 Tensor |
- | Tensor FP16-16 45.98 TFLOPSTensor FP16-32 45.98 TFLOPS |
- | BF16 91.96 TFLOPSTensor BF16 45.98 TFLOPS |
FP32 16.67 TFLOPS | FP32 45.98 TFLOPS |
FP64 1.04 TFLOPS | FP64 1.44 TFLOPS |
Tensor INT4 - | Tensor INT4 183.9 TOPS |
- | Tensor INT8 45.98 TOPS |
Pixel Rate 208.3 GPixel/s | Pixel Rate 359.2 GPixel/s |
Texture Rate 520.8 GTexel/s | Texture Rate 718.4 GTexel/s |
Shaders 3,840 Shaders | Shaders 5,120 Shaders |
TMUs 240 TMUs | TMUs 320 TMUs |
ROPs 96 ROPs | ROPs 160 ROPs |
Tensor Cores - | Tensor Cores 160 T-Cores |
RT Cores 60 RT-Cores | RT Cores 80 RT-Cores |
CUs 60 CUs | CUs 80 CUs |
Base Clock 1.85GHz | Base Clock 1.88GHz |
Boost Clock 2.17GHz | Boost Clock 2.25GHz |
L2 Cache 4.1MB shared | L2 Cache 6.1MB shared |
L3 Cache 128MB shared | L3 Cache 64MB shared |
L3 Bandwidth 1.66TB/s | L3 Bandwidth 2.25TB/s |
16GB GDDR6 | 16GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 16GT/s | Memory Speed 18GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 576GB/s |
ECC No | ECC No |
TDP 250W | TDP 260W |
Max Temp 110°C Max | Max Temp - |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
- | 2x DisplayPort 2.1 |
3x DisplayPort 1.4 | - |
1x HDMI 2.1 | 1x HDMI 2.1 |
- | 1x USB-C |
Encoder Model VCN 3.0 | Encoder Model VCN 4.0 |
Decoder Model VCN 3.0 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2.7-Slots | PCIe 2.5-Slots |
Height 135 mm (5.32")Width 310 mm (12.2")Depth 54 mm (2.13") | Height 110 mm (4.33")Width 276 mm (10.87")Depth 51 mm (2.01") |
Cooling Open-Air 3x Fans | Cooling Open-Air 3x Fans |
Power Connectors 2x 8-Pin | Power Connectors 2x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Sienna Cichlid | Codename Plum Bonito |
Chip Variant Navi 21 XL | Chip Variant Navi 31 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Nov 18, 2020 | Release Date Jul 27, 2023 |
Foundry TSMC | Foundry TSMC |
Other Foundries - | Other Foundries TSMCMCD |
Fabrication Node N7 - | Fabrication Node N5 N6MCD |
Die Size 520mm² - | Die Size 304mm² 150mm²MCD |
Transistor Count 26.8 Billion - | Transistor Count 45.4 Billion 8.2 BillionMCD |
Transistor Density 51.56 MTr/mm² - | Transistor Density 149.2 MTr/mm² 54.67 MTr/mm²MCD |
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