GPUs

Intel Graphics 4C 2300MHz vs AMD Radeon 860M 3000MHz Full Specs

512 Shaders
2.3GHz
384 Shaders
3GHz
Shared Memory136.5GB/s
·
Shared Memory128GB/s
·
··
2.35 TFLOPS
··
2.3 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Graphics 4C 2300MHzGraphics 4C 2300MHz75.37 TOPSINT4 Tensor
x16.36
Radeon 860M 3000MHzRadeon 860M 3000MHz4.61 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
···
Peak OPS
75.37 TOPSINT4 Tensor
Peak OPS
4.61 TFLOPSFP16
Tensor FP16-32
18.84 TFLOPS
-
BF16
-
Tensor BF16
18.84 TFLOPS
BF16
4.61 TFLOPS
Tensor BF16
-
FP32
2.35 TFLOPS
FP32
2.3 TFLOPS
FP64
588.8 GFLOPS
FP64
144 GFLOPS
Tensor INT4
75.37 TOPS
Tensor INT4
-
Tensor INT8
37.68 TOPS
-
Pixel Rate
36.8 GPixel/s
Pixel Rate
96 GPixel/s
Texture Rate
73.6 GTexel/s
Texture Rate
72 GTexel/s

Shaders
512 Shaders
Shaders
384 Shaders
TMUs
32 TMUs
TMUs
24 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
Tensor Cores
32 T-Cores
Tensor Cores
-
RT Cores
4 RT-Cores
RT Cores
6 RT-Cores
EUs
32 EUs
CUs
6 CUs

Base Clock
-
Base Clock
1.5GHz
Boost Clock
2.3GHz
Boost Clock
3GHz

L2 Cache
4.1MB shared
L2 Cache
-

Shared Memory
·
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8.5GT/s
Memory Speed
8GT/s
Memory Bandwidth
136.5GB/s
Memory Bandwidth
128GB/s

Multi-Monitor
3
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Xe Media Engine
Encoder Model
VCN 4.0

Decoder Model
Xe Media Engine
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Graphics 2024 branding
Branding
Radeon 2023 branding
Codename
Xe3 LPG
Codename
Strix Point
Chip Variant
GT1
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 5, 2026
Release Date
Jan 6, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
Intel 3
Fabrication Node
N4P
Die Size
27mm²
Die Size
233mm²
Transistor Count
-
Transistor Count
28 Billion
Transistor Density
-
Transistor Density
120 MTr/mm²

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