Qualcomm Adreno 690 vs NVIDIA GeForce RTX 3050 Laptop 80W Full Specs
1,536 Shaders 680MHz | 2,048 Shaders 1.74GHz |
Shared Memory68.3GB/sLPDDR4X | 4GB GDDR6192GB/s placeholder |
·· 2.09 TFLOPS | ·· 7.13 TFLOPS |
Form Factor iGPU | Form Factor Soldered |
TDP 5W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 4.18 TFLOPSFP16 | Peak OPS 228.1 TOPSINT4 Tensor Sparse |
- | Tensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS |
- | BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS |
Tensor TF32 - | Tensor TF32 7.13 TFLOPS |
FP32 2.09 TFLOPS | FP32 7.13 TFLOPS |
FP64 522.2 GFLOPS | FP64 111.4 GFLOPS |
Tensor INT4 - | Tensor INT4 114 TOPS |
- | Tensor INT8 57.02 TOPS |
Ray - | Ray 10.75 TOPS |
Pixel Rate 32.6 GPixel/s | Pixel Rate 55.7 GPixel/s |
Texture Rate 65.3 GTexel/s | Texture Rate 111.4 GTexel/s |
Shaders 1,536 Shaders | Shaders 2,048 Shaders |
TMUs 96 TMUs | TMUs 64 TMUs |
ROPs 48 ROPs | ROPs 32 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 16 RT-Cores |
EUs 12 EUs | SMs 16 SMs |
Base Clock 660MHz | Base Clock 1.49GHz |
Boost Clock 680MHz | Boost Clock 1.74GHz |
L2 Cache 512KB shared | L2 Cache 2MB shared |
L3 Cache 3MB shared | L3 Cache - |
Shared MemoryLPDDR4X | 4GB GDDR6 placeholder |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 4.3GT/s | Memory Speed 12GT/s |
Memory Bandwidth 68.3GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 5W | TDP 80W |
Multi-Monitor 1 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Hexagon 690 | Encoder Model NVENC 7 |
Decoder Model Hexagon 690 | Decoder Model NVDEC 5 |
Form Factor iGPU | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename - | Codename NV177 |
Chip Variant - | Chip Variant GA107-140-A1 |
Market Segment Smartphone | Market Segment Laptop |
Release Date Aug 30, 2020 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N7 | Fabrication Node 8N |
Die Size - | Die Size 200mm² |
Transistor Count - | Transistor Count 8.7 Billion |
Transistor Density - | Transistor Density 43.5 MTr/mm² |
No images available
No images available
CPUs | CPUs - |
Laptops | Laptops |
Tablets | Tablets - |
All-in-Ones - | All-in-Ones |



