AMD Ryzen AI Max 390 vs Intel Core Ultra 9 275HX
AMD Ryzen AI Max 390
Intel Core Ultra 9 275HX
$689
|
12 Cores
24 Threads
3.2GHz Clock
|
24 Cores
24 Threads
2.7GHz Clock
|
|
Socket
FP11
|
Socket
BGA 2114
|
|
iGPU
Radeon 8050S
11.47 TFLOPS FP32
|
iGPU
Graphics 4C 1900MHz
1.95 TFLOPS FP32
|
GB6 Single-Core
|
|
Ryzen AI Max 390 - GB6S 2,835
x1
Core Ultra 9 275HX - GB6S 3,045
x1.07
GB6 Multi-Core
|
|
Ryzen AI Max 390 - GB6M 18,795
x1.22
Core Ultra 9 275HX - GB6M 15,410
x1
|
|
Ryzen AI Max 390 - 256.0GB/s
x2.5
Core Ultra 9 275HX - 102.4GB/s
x1
|
|
Ryzen AI Max 390 - 65W
x1.18
Core Ultra 9 275HX - 55W
x1
|
|
Ryzen AI Max 390 - 11.47 TFLOPS FP32
x5.88
Core Ultra 9 275HX - 1.95 TFLOPS FP32
x1
|
|
Ryzen AI Max 390 - 50 TOPS INT8
x3.85
Core Ultra 9 275HX - 13 TOPS INT8
x1
|
GB6S 2,835
70%
|
GB6S 3,045
75%
|
|
GB6M 18,795
70%
|
GB6M 15,410
58%
|
|
0%
|
0%
|
|
0%
|
0%
|
|
Manufacturer
AMD
|
Manufacturer
Intel
|
|
Architecture
Zen 5
|
Architecture
Arrow Lake
|
|
Family
Ryzen AI 300
|
Family
Core Ultra Series 2
|
|
Instruction Set (ISA)
x86-64
|
Instruction Set (ISA)
x86-64
|
|
Codename
Strix Halo
Eldora
-
-
Zen 5
-
-
|
Codename
-
-
Arrow Lake-S-8P-16E
P-Core
Lion Cove
E-Core
Skymont
|
|
Market Segment
Laptop
|
Market Segment
Laptop
|
|
Release Date
1/6/2025
|
Release Date
1/6/2025
|
|
Foundry
TSMC
TSMC (SoC Die)
-
-
|
Foundry
TSMC
TSMC (iGPU Die)
TSMC (SoC Die)
TSMC (IO Die)
|
|
Node
N4X
N5 (SoC Die)
-
-
|
Node
N3B
N5 (iGPU Die)
N6 (SoC Die)
N6 (IO Die)
|
|
Die Size
2x 71 mm²
-
-
-
|
Die Size
135 mm²
23 mm² (iGPU Die)
100 mm² (SoC Die)
28 mm² (IO Die)
|
|
Transistor Count
2x 8.3 Billion
|
Transistor Count
Unknown
|
|
12 Cores
-
-
|
24 Cores
8 P-Cores
16 E-Cores
|
|
24 Threads
-
-
|
24 Threads
8 P-Threads
16 E-Threads
|
|
-
3.2GHz
5GHz Boost
|
P-Core
2.7GHz
5.4GHz Boost
|
|
-
-
-
|
E-Core
2.1GHz
4.6GHz Boost
|
|
Overclocking
Locked
|
Overclocking
Unlocked
|
|
Type
PCIe
|
Type
DMI
|
|
Transfer Rate
16GT/s
|
Transfer Rate
16GT/s
|
|
Lanes
4
|
Lanes
8
|
|
Bandwidth
8GB/s
|
Bandwidth
16GB/s
|
|
Bi-directional
16GB/s
|
Bi-directional
32GB/s
|
|
L0 Instruction
|
L0 Instruction
|
|
L0 Data
|
L0 Data
|
|
L1 Instruction
32KB/Core
8-way set associative
-
-
|
L1 Instruction
64KB/P-Core
8-way set associative
64KB/E-Core
8-way set associative
|
|
L1 Data
48KB/Core
12-way set associative
-
-
|
L1 Data
48KB/P-Core
12-way set associative
32KB/E-Core
8-way set associative
|
|
L2
1024KB/Core
16-way set associative
-
-
|
L2
3072KB/Core
10-way set associative
16MB Shared (E-Core)
16-way set associative
|
|
L3
64MB Shared
16-way set associative
|
L3
24MB Shared
12-way set associative
|
|
Channels
4
|
Channels
2
|
|
Max Memory
128GB
|
Max Memory
192GB
|
|
ECC
Not Supported
|
ECC
Not Supported
|
|
Bus Width/Channel
64Bit
Bus Width
256Bit
|
Bus Width/Channel
64Bit
Bus Width
128Bit
|
|
Clock
4000MHz
Transfer Rate
8000MT/s
|
Clock
3200MHz
Transfer Rate
6400MT/s
|
|
Bandwidth/Channel
64.0GB/s
Bandwidth
256.0GB/s
|
Bandwidth/Channel
51.2GB/s
Bandwidth
102.4GB/s
|
|
TDP
65W
45W cTDP Down
120W cTDP Up
-
|
TDP
55W
45W cTDP Down
-
160W Peak
|
|
Temp
100°C Max
|
Temp
105°C Max
|
|
Included Cooler
|
Included Cooler
|
|
PCIe 4.0 x16 Lanes
|
PCIe 5.0 x20 Lanes
PCIe 4.0 x4 Lanes
|
|
Radeon 8050S
2048 Shaders
2800MHz
11.47 TFLOPS FP32
|
Graphics 4C 1900MHz
512 Shaders
1900MHz
1.95 TFLOPS FP32
|
|
XDNA 2
|
AI Boost 3
|
|
32 Cores
|
2 Cores
|
|
50 TOPS INT8
|
13 TOPS INT8
|
|
No Cellular
|
No Cellular
|
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