Intel Core i3-10110U vs AMD Ryzen 3 3250U Full Specs

Summary

2 Cores 4 Threads 2.1GHz	2 Cores 4 Threads 2.6GHz
TDP 15W	TDP 15W
Bandwidth 46.9GB/s LPDDR4·DDR4·LPDDR3	Bandwidth 38.4GB/s DDR4
iGPU UHD 620 1000MHz	iGPU Radeon Vega 3 1200MHz
Peak·FP32·FP16 384 GFLOPSFP16	Peak·FP32·FP16 921.6 GFLOPSFP16
Socket BGA 1528	Socket FP5

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-10110U1,096

x1.31

Ryzen 3 3250U835

x1

Show Top Score

Core Config

2 Cores	2 Cores
4 Threads	4 Threads

Clocks

Base Clock 2.1GHz	Base Clock 2.6GHz
Boost Clock 4.1GHz	Boost Clock 3.5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 64KB
L1d 32KB	L1d 32KB
L2 256KB	L2 512KB
L3 4MB	L3 4MB

Memory

Type LPDDR4·DDR4·LPDDR3	Type DDR4
Max Memory 32GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2933MT/s	Speed 2400MT/s
Bandwidth 46.9GB/s	Bandwidth 38.4GB/s
Bandwidth Calculator Channels Transfer Rate2933MT/s Calculated Bandwidth 46.9GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s

Power & Thermals

TDP 15W	TDP 15W
cTDP-down 10W	cTDP-down 12W
cTDP-up 25W	cTDP-up 25W
Max Operating Temp 100°C Max	Max Operating Temp 95°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

iGPU

iGPU UHD 620 1000MHz	iGPU Radeon Vega 3 1200MHz
Shaders 192	Shaders 192
Boost Clock 1GHz	Boost Clock 1.2GHz
Peak·FP32·FP16 384 GFLOPSFP16	Peak·FP32·FP16 921.6 GFLOPSFP16

Controller

Controller Model 400 Series U+	Controller Model -
Codename Comet Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Zen
Family Core 10th Gen	Family Ryzen 3000
Branding	Branding
Codename Comet Lake-H Comet Lake-4CVariant	Codename Dali -
Market Segment Laptop	Market Segment Laptop
Release Date Aug 21, 2019	Release Date Jan 6, 2020

Fabrication

Foundry Intel	Foundry GlobalFoundries
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 14nm+++ 14nmPCH	Fabrication Node 14LP -
Die Size 126mm² 37mm²PCH	Die Size 149mm² -
Transistor Count 2.1 Billion	Transistor Count 3.5 Billion
Transistor Density 17 MTr/mm²	Transistor Density 24 MTr/mm²

Images

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Used In

Laptops Notebook Plus(Mid 2020)Galaxy Chromebook 2(Early 2021)Galaxy Book Flex 13 Alpha(Late 2019) Show 1 more

Laptops Inspiron 15(3525, Early 2023)

Competitors

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AMDRyzen 3 3250U vs CPU IntelCore Ultra 9 386H AMDRyzen 3 3250U vs CPU IntelCore Ultra 5 322 AMDRyzen 3 3250U vs CPU IntelCore Ultra 5 335 Show 12 more