Intel Core i3-L13G4 vs AMD Ryzen 3 PRO 5450U Full Specs

Summary

5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz	4 Cores 8 Threads 2.6GHz
TDP -	TDP 15W
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 68.3GB/s LPDDR4X·DDR4
iGPU UHD 48EU 500MHz Gen 11	iGPU Radeon Vega 6 1600MHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 2.46 TFLOPSFP16
Socket CSP 1016	Socket FP6

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-L13G4646

x1

Ryzen 3 PRO 5450U1,618

x2.50

Show Top Score

Core Config

5 Cores 1P 4E	4 Cores 4P -
6 Threads 2P 4E	8 Threads 8P -

Clocks

Base Clock 800MHz	Base Clock 2.6GHz
Boost Clock 2.8GHz	Boost Clock 4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 32KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 32KB P -
L2 512KB P 1.5MB E shared	L2 512KB P -
L3 8MB	L3 8MB

Memory

Type LPDDR4X	Type LPDDR4X·DDR4
Max Memory 8GB	Max Memory 32GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 4266MT/s	Speed 4266MT/s
Bandwidth 34.1GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 68.3GB/s

Power & Thermals

TDP -	TDP 15W
cTDP-down -	cTDP-down 10W
cTDP-up -	cTDP-up 25W
Max Operating Temp 100°C Max	Max Operating Temp 105°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

iGPU

iGPU UHD 48EU 500MHz Gen 11	iGPU Radeon Vega 6 1600MHz
Shaders 384	Shaders 384
Boost Clock 500MHz	Boost Clock 1.6GHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 2.46 TFLOPSFP16

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Lakefield	Architecture Zen 3
Family Core 11th Gen	Family Ryzen 5000
Branding	Branding
Codename Lakefield Sunny CoveP-Core TremontE-Core	Codename Cezanne - -
Market Segment Laptop	Market Segment Laptop
Release Date May 28, 2020	Release Date Mar 16, 2021

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelIO	Other Foundries -
Fabrication Node 10nm+ 22nmIO	Fabrication Node N7 -
Die Size 82mm² 92mm²IO	Die Size 180mm² -
Transistor Count 4 Billion 650 MillionIO	Transistor Count 10.7 Billion -
Transistor Density 49 MTr/mm² 7 MTr/mm²IO	Transistor Density 59 MTr/mm² -

Images

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Used In

Laptops Galaxy Book S(Mid 2020)

Laptops -

Competitors

IntelCore i3-L13G4 vs CPU AMDRyzen AI 5 340 IntelCore i3-L13G4 vs CPU AMDRyzen 5 220 IntelCore i3-L13G4 vs CPU AMDRyzen 3 PRO 210 Show 4 more

AMDRyzen 3 PRO 5450U vs CPU AMDRyzen 3 5305GE AMDRyzen 3 PRO 5450U vs CPU AMDRyzen 3 5305G AMDRyzen 3 PRO 5450U vs CPU AMDRyzen 5 5605GE Show 12 more