Intel Core i3-L13G4 vs AMD Ryzen AI 5 340 Full Specs

Summary

5 Cores(1P+4E) 6 Threads(2P+4E) 800MHz	6 Cores(3P+3E) 12 Threads(6P+6E) 2GHz
TDP -	TDP 28W
Bandwidth 34.1GB/s LPDDR4X	Bandwidth 128GB/s LPDDR5X·DDR5
iGPU UHD 48EU 500MHz Gen 11	iGPU Radeon 840M 2900MHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 2.97 TFLOPSFP16
Socket CSP 1016	Socket FP8

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i3-L13G4646

x1

Ryzen AI 5 340-

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Core Config

5 Cores 1P 4E	6 Cores 3P 3E
6 Threads 2P 4E	12 Threads 6P 6E

Clocks

Base Clock 800MHz	Base Clock 2GHz
Boost Clock 2.8GHz	Boost Clock 4.8GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 32KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 48KB P -
L2 512KB P 1.5MB E shared	L2 1MB P -
L3 8MB	L3 16MB

Memory

Type LPDDR4X	Type LPDDR5X·DDR5
Max Memory 8GB	Max Memory 256GB
ECC No	ECC No
Channels 1	Channels 2
Bus Width 64-bit	Bus Width 128-bit
Speed 4266MT/s	Speed 8000MT/s
Bandwidth 34.1GB/s	Bandwidth 128GB/s
Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s

Power & Thermals

TDP -	TDP 28W
cTDP-down -	cTDP-down 15W
cTDP-up -	cTDP-up 54W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler 0

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 16GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x6 5.9GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU UHD 48EU 500MHz Gen 11	iGPU Radeon 840M 2900MHz
Shaders 384	Shaders 256
Boost Clock 500MHz	Boost Clock 2.9GHz
Peak·FP32·FP16 768 GFLOPSFP16	Peak·FP32·FP16 2.97 TFLOPSFP16

NPU

NPU Model -	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance -	Performance 50 TOPSINT8

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Lakefield	Architecture Zen 5
Family Core 11th Gen	Family Ryzen AI 300
Branding	Branding
Codename Lakefield Sunny CoveP-Core TremontE-Core	Codename Strix Point Zen 5P-Core Zen 5cE-Core
Market Segment Laptop	Market Segment Laptop
Release Date May 28, 2020	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelIO	Other Foundries -
Fabrication Node 10nm+ 22nmIO	Fabrication Node N4P -
Die Size 82mm² 92mm²IO	Die Size 233mm² -
Transistor Count 4 Billion 650 MillionIO	Transistor Count 28 Billion -
Transistor Density 49 MTr/mm² 7 MTr/mm²IO	Transistor Density 120 MTr/mm² -

Images

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Used In

Laptops Galaxy Book S(Mid 2020)

Laptops Framework 13(Early 2025)

Competitors

IntelCore i3-L13G4 vs CPU AMDRyzen AI Max PRO 380 IntelCore i3-L13G4 vs CPU AMDRyzen AI 5 PRO 340 IntelCore i3-L13G4 vs CPU AMDRyzen 3 PRO 210 Show 4 more

AMDRyzen AI 5 340 vs CPU AMDRyzen AI 5 PRO 340 AMDRyzen AI 5 340 vs CPU AMDRyzen 5 240 AMDRyzen AI 5 340 vs CPU AMDRyzen 5 PRO 220 Show 12 more